Liquid Cooling Heat Dissipation Structure for Electronic Devices
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Solution Overview
Problem
Conventional heat dissipation methods for electronic devices, such as using heat conducting elements, are inefficient and dependent on external temperature, leading to suboptimal heat removal as more components are integrated into devices.
Innovation Solution
A heat dissipation structure incorporating a closed loop with a refrigerant fluid, a water pump, and an interposer sandwiched between circuit boards, along with a pipe and sealing elements, which circulates refrigerant fluid to absorb and dissipate heat efficiently, utilizing a temperature sensor and controller to manage fluid circulation based on temperature thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat conducting elements are used to contact the heat source and housing, then heat dissipation is achieved, but the heat dissipation efficiency is low and dependent on external temperature
Solution Approach 1:
The patent employs a liquid cooling system where a coolant flows through channels in the heat dissipation structure, utilizing fluid dynamics to efficiently remove heat from the electronic device regardless of external temperature conditions
Solution Approach 2:
The patent changes the heat dissipation mechanism from passive thermal conduction through solid contacts to active convective cooling through fluid flow, fundamentally altering the thermal management parameters and achieving temperature-independent heat dissipation efficiency
2Adaptability or versatility
If more components are integrated into the electronic device, then functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional surface contact heat dissipation to three-dimensional internal channel cooling, allowing heat to be removed from multiple points simultaneously throughout the device volume, thereby accommodating higher component integration densities
Solution Approach 2:
The heat dissipation structure is divided into multiple segments with separate cooling channels that can be independently configured to match the thermal distribution patterns of different component regions, enabling effective heat management in highly integrated devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency by actively managing refrigerant fluid circulation, ensuring effective heat transfer from the circuit board assembly to the housing, improving thermal management in electronic devices.
Implementation Method 1
The pipe (40) communicates with the circuit board assembly (20) and the water pump (60) to form a closed loop... transfer the heat generated by the circuit board assembly (20) to the pipe (40)
Implementation Method 2
The water pump (60) is configured to circulate the refrigerant fluid (50) in the closed loop... circulates refrigerant fluid to absorb and dissipate heat efficiently
Data Source
AI summary
A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly.