Liquid Cooling Plate Buffer Structure for Lower Flow Resistance

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Solution Overview

Problem

Existing liquid cooling devices face issues with flow resistance and increased system complexity due to the use of separate air and liquid cooling systems, and the design of cooling plates with larger diameters than connecting pipelines, leading to reduced cooling rates and increased manufacturing costs.

Innovation Solution

A cooling device with a cooling plate featuring a flow passage, buffer portions, and inclined buffer sections to reduce flow resistance, along with a horizontal arrangement of inlet and outlet pipes to minimize interference and maintain a thin design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If an external liquid pipeline is directly connected to a cooling plate, then the cooling structure is simplified, but the liquid encounters flow resistance when flowing to the cooling plate

Engineering Contradiction:
Improvecooling structureVSAvoidflow resistance
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces a buffer portion as an intermediary component between the liquid pipeline and the cooling plate. This buffer portion includes a buffer cavity that receives liquid from the pipeline and guides it into the flow passage, avoiding direct connection and reducing flow resistance and water hammer effects.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the cooling plate has a diameter larger than the connecting pipeline, then the connection is simplified, but the thickness of the cooling plate increases

Engineering Contradiction:
Improveconnection simplicityVSAvoidcooling plate thickness
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent resolves the dimensional conflict by changing the connection approach from planar (diameter-matching) to three-dimensional. The buffer portion extends in the thickness direction of the cooling plate, allowing the pipeline to connect to the buffer cavity rather than requiring the cooling plate diameter to match the pipeline diameter, thus maintaining thin plate design while simplifying connection.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Speed

If liquid flows directly into the cooling plate from the pipeline, then the flow path is shortened, but the pressure fluctuation increases

Engineering Contradiction:
Improveliquid flow speedVSAvoidpressure stability
Core Design Contradiction:
SpeedVSStability of the object's composition

Solution Approach 1:

The patent applies beforehand cushioning by designing a buffer portion with a buffer cavity that receives liquid from the pipeline before it enters the flow passage. This buffer cavity cushions pressure fluctuations and prevents water hammer effects, stabilizing the liquid flow before it reaches the cooling channels.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces flow resistance and power loss within the cooling plate while allowing for a thinner design, thereby saving manufacturing costs and enhancing cooling efficiency.

Implementation Method 1

the first buffer section is arranged close to the inlet buffer zone for buffering a pressure of the liquid flowing into the cooling plate; the second buffer section is arranged close to the outlet buffer zone for buffering a pressure of the liquid flowing out of the cooling plate

Methodology Applied
Scientific EffectPressure buffering: Hydraulic Accumulator

Implementation Method 2

in a length direction of the cooling device, the first buffer section is inclined to the cooling section relative to the water inlet section; in the length direction of the cooling device, the second buffer section is inclined to the cooling section relative to the water outlet section

Methodology Applied
Scientific EffectFlow resistance reduction through geometric design: Inclined Plane

Implementation Method 3

In recent years, liquid cooling has gradually been favored by the market and has become one of the mainstream developments in the field of electronic heat dissipation

Methodology Applied
Scientific EffectLiquid cooling: Convection

Data Source

PatentEP4093168B1Cooling device and electronic device
Publication Date: 2025.09.17 SHENZHEN ENVICOOL TECH
  • EP4093168B1 patent drawingFigure 1~2
  • EP4093168B1 patent drawingFigure 3~5
  • EP4093168B1 patent drawingFigure 6

AI summary

A cooling device includes a cooling plate and a buffer portion, a flow passage is formed in the cooling plate, and the buffer portion is arranged on the cooling plate. An inlet buffer zone and an outlet buffer portion are defined in the buffer portion, liquid flows into the flow passage through the inlet buffer zone and flows out of the flow passage through the outlet buffer portion. The liquid flows into the flow passage through the buffer portion, and the buffer portion can reduce the flow resistance of the liquid flowing into the flow passage. The liquid in the flow passage also flows out through the buffer portion, and the buffer portion can also reduce the flow resistance of the liquid flowing out of the flow passage.