Liquid Ejecting Head Bonding Surface Imaging

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Solution Overview

Problem

The existing methods for manufacturing liquid ejecting heads, such as ink jet type recording heads, face challenges in precisely judging the adhesion state of bonding surfaces due to unclear focal point distances when using infrared microscopes for non-destructive evaluation.

Innovation Solution

A method involving the precise measurement of the focal point distance of an imaging unit using a non-contact measuring unit, such as a laser type range finder, allows for high-precision imaging of bonding surfaces by calculating the focal point distance based on measured distances between a reference point and the bonding surface, enabling accurate confirmation of adhesion states and reducing defects from bonding failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If infrared rays are transmitted through silicon members using an infrared microscope to confirm bonding surfaces, then non-destructive evaluation is enabled, but the focal point distance is unclear and judgment precision deteriorates

Engineering Contradiction:

Improvenon-destructive evaluation capabilityVSAvoidadhesion state judgment precision

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent measures the distance from the imaging unit to the bonding surface before performing the actual imaging. This preliminary measurement of the focal point distance allows the imaging unit to be properly focused on the bonding surface, thereby achieving both non-destructive evaluation and high-precision adhesion state judgment.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces a reference surface on the second silicon member as an intermediary reference point. By measuring the distance to this reference surface and calculating the focal point distance, the system establishes a reliable reference for focusing the imaging unit on the bonding surface, resolving the focal point uncertainty.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If members with different sizes are laminated using an adhesive agent, then liquid ejecting head structure is formed, but bonding surface adhesion state cannot be precisely confirmed

Engineering Contradiction:

Improvelaminating process feasibilityVSAvoidbonding surface adhesion confirmation precision

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent utilizes the size difference between the first and second silicon members to create a reference surface that extends beyond the bonding area. This dimensional approach allows the imaging unit to focus on the bonding surface by using the larger reference surface as a focusing reference, enabling precise adhesion confirmation while maintaining the laminated structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of operation

If focal point distance is not clearly determined, then imaging of bonding surface cannot be performed with high precision, but adhesion state judgment requires high precision

Engineering Contradiction:

Improveimaging operation simplicityVSAvoidbonding surface imaging precision

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces manual focusing adjustment with an automated focusing system. By measuring the distance to the reference surface and calculating the focal point distance, the system automatically determines the correct focus position, eliminating the need for manual adjustment while achieving high-precision imaging of the bonding surface.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high-precision judgment of the adhesion state, suppressing defects caused by bonding failures and allowing for more reliable manufacturing of liquid ejecting heads with improved imaging precision.

Implementation Method 1

there is proposed a manufacturing method where the bonding surfaces are confirmed in a non-destructive manner by confirming the bonding surfaces by transmitting infrared rays through the silicon members using an infrared microscope utilizing the property that infrared rays are transmitted through silicon

Methodology Applied

Scientific EffectInfrared transmission through silicon: Absorption (EM radiation)

Implementation Method 2

the measuring of the distance between the reference point and the surface which extends from a bonding surface of the second member be performed using a non-contact type measuring unit. Due to this, it is possible to suppress the generation of scratches or chipping due to contact with the second member. In this case, it is preferable that the measuring unit be a laser type range finder.

Methodology Applied

Scientific EffectLaser ranging: Laser

Data Source

PatentUS9463611B2Method of manufacturing liquid ejecting head

Publication Date: 2016.10.11 SEIKO EPSON CORP

AI summary

Disclosed is a method of manufacturing a liquid ejecting head where first and second members with different sizes which are formed of silicon are laminated with an adhesive agent. The method includes measuring a distance between a reference point which is positionally aligned in the laminating direction with respect to an imaging unit and a surface which extends from the bonding surface of the second member, and imaging the bonding surface by calculating a focal point distance of the imaging unit based on the distance which is measured and a distance between the imaging unit and the reference point.