Controlling Lamination TRIZ Cases
- Sheet Sticking Apparatus Tension Control for Wafer Adhesion
Tension measuring means maintains constant adhesive sheet tension to prevent creases, air bubbles, and warp deformation on semiconductor wafers.
- Wafer Bonding via Bowing and Hydrophilization to Prevent Voids
Bowing substrates during hydrophilized bonding aligns central portions first, preventing trapped air voids while maintaining high positional precision.
- Rotary Ultrasonic Welding Depth Control via Raised Profile
A rotary ultrasonic welding horn uses a raised profile to control seal line depth, eliminating mechanical wear and concentricity errors.
- Mobile Label Replacement Robot with Image Sensor Feedback
An automated label replacement robot navigates support structures, detects reference features via image data, and removes old labels to place new ones.
- Liquid Ejecting Head Bonding Surface Imaging
A liquid ejecting head manufacturing method calculates focal point distance using a laser range finder to image silicon bonding surfaces.
- Thermoplastic Composite Welding Geometry Correction
Re-warming joining zones corrects thermal expansion deviations in fiber-reinforced plastics, eliminating rivets and weight penalties.