Sheet Sticking Apparatus Tension Control for Wafer Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sheet sticking apparatuses fail to maintain constant tension during the sticking process, leading to creases, air bubbles, and warp deformation, and result in wasteful consumption of adhesive sheets due to inefficient feeding and cutting methods.
Innovation Solution
A sheet sticking apparatus with a tension measuring means, including a load cell and tension measuring roller, maintains constant tension and sticking angle, and a press roller with a peel plate setup that ensures the sheet is fed out longer than the object, minimizing wastage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If guide rollers nip the adhesive sheet constantly throughout sticking operation, then the adhesive sheet can be fed and positioned, but a line-like dent portion is formed on the adhesive layer causing unevenness or breakage in the wafer
Solution Approach 1:
The harmful function of the guide rollers (nipping the sheet) is extracted and separated from the feeding function. The guide rollers only guide the sheet during feeding, while a separate tension control mechanism applies tension only during sticking operation, eliminating the dent portion caused by continuous nipping.
Solution Approach 2:
The tension control mechanism dynamically adjusts the nipping force of the tension control rollers based on the operational phase. During feeding, minimal or no tension is applied; during sticking, appropriate tension is applied. This dynamic adjustment prevents dent formation while maintaining feeding capability.
2Speed
If excessive tension is given to the adhesive sheet during sticking, then the sheet can be fed smoothly, but warp deformation is caused on the wafer after sticking
Solution Approach 1:
The tension control mechanism incorporates feedback control to monitor and adjust the tension applied to the adhesive sheet in real-time during the sticking operation, ensuring that the tension remains within an optimal range that prevents both feeding issues and wafer deformation.
Solution Approach 2:
The tension control mechanism dynamically changes the tension parameter during the sticking process, adjusting it according to the specific stage of operation and the properties of the adhesive sheet and wafer, thereby optimizing both feeding smoothness and wafer flatness.
3Ease of operation
If the adhesive sheet is fed with shortage of tension, then feeding is easier, but creases are generated on the adhesive sheet and air bubbles are caught
Solution Approach 1:
The tension control mechanism dynamically adjusts the tension level based on the operational phase. During feeding, lower tension is applied for ease of operation; during sticking, tension is increased to prevent creases and air bubbles, achieving both feeding ease and adhesive sheet flatness.
4Loss of substance
If the sheet length fed out is exactly matching the object size, then material usage is optimized, but any positioning error causes complete waste of the sheet
Solution Approach 1:
The sheet is fed out to a length slightly exceeding the object size, allowing for partial usage even if positioning is not perfect. This ensures that the adhesive sheet can still be effectively utilized without complete waste, balancing material consumption with positioning reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents creases, air bubbles, and warp deformation by maintaining constant tension and sticking angle, reducing wasteful consumption of adhesive sheets by optimizing the sheet length and usage.
Implementation Method 1
the tension measuring means preferably includes a load cell and a tension measuring roller
Implementation Method 2
the tension measuring means preferably includes a load cell and a tension measuring roller
Implementation Method 3
a press roller for imparting a press force to the sheet to stick the sheet from one end toward the other end of the plate-like object
Data Source
AI summary
A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 for feeding out an adhesive sheet S to a position facing a surface of a semiconductor wafer W, and a press roller 14 for imparting a press force to the adhesive sheet S to stick the adhesive sheet S to the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring the tension of the adhesive sheet S between a feed-out head 49 and the press roller 14. The tension measuring means 35 maintains the tension to a constant level to prevent catching of air bubbles between the adhesive sheet S and the wafer W as well as to prevent warp deformation of the wafer stuck with the sheet.