Liquid Lens Array Separation Using Laser Perforation
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Solution Overview
Problem
Mechanical dicing of liquid lenses can cause defects during separation from an array of liquid lenses, leading to suboptimal performance and potential damage.
Innovation Solution
A method involving laser emission to create a series of perforations through the object, allowing for stress application to separate the liquid lenses without defects, where the laser wavelength is transparent to the object's thickness, and bonding layers are optimized to facilitate perforation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical dicing is used to separate liquid lenses from an array, then separation can be achieved, but defects are caused in the liquid lens leading to suboptimal performance
Solution Approach 1:
The patent replaces the mechanical dicing system with a laser-based system. Instead of using mechanical blades to cut through the liquid lens array, a laser emits light at a specific wavelength that is absorbed by the liquid crystal material, creating perforations that allow for clean separation without mechanical contact. This substitution eliminates the defects caused by mechanical stress and contact while maintaining efficient separation capability.
Solution Approach 2:
The patent utilizes parameter changes by selecting a specific laser wavelength that matches the absorption characteristics of the liquid crystal material. By tuning the laser wavelength to be absorbed by the liquid crystal while passing through the transparent encapsulation layers, the system achieves selective perforation. This parameter optimization allows the laser energy to be concentrated in the liquid crystal layer, creating clean separation paths without damaging the surrounding structure.
2Reliability
If laser emission is used to perforate the object, then precise separation without defects is achieved, but the object must be transparent to the laser wavelength
Solution Approach 1:
The patent applies local quality by designing a multilayer structure where different materials have different optical properties. The encapsulation layers are made transparent to the laser wavelength, while the liquid crystal layer is made absorbing. This spatial differentiation of material properties allows the laser to selectively interact with only the liquid crystal layer, creating perforations precisely where needed without affecting the encapsulation layers or adjacent liquid lenses.
Solution Approach 2:
The transparent encapsulation layers act as intermediaries that allow the laser wavelength to pass through to reach the liquid crystal layer. These layers mediate between the laser source and the liquid crystal material, enabling the laser energy to be delivered to the target layer while protecting the outer encapsulation structures from direct laser exposure and potential damage.
3Manufacturing precision
If bonding layers are added to facilitate laser perforation, then separation precision is improved, but device complexity increases
Solution Approach 1:
The patent achieves universality by designing bonding layers that serve multiple functions simultaneously. These layers provide both structural bonding between components and optical transparency to the laser wavelength. By integrating these dual functions into a single layer design, the patent avoids adding extra complexity while maintaining the necessary optical properties for precise laser perforation and the mechanical integrity for stable device assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise separation of liquid lenses without defects, ensuring improved performance and reliability by using laser-induced perforations and stress application, while maintaining transparency and structural integrity.
Implementation Method 1
using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations
Implementation Method 2
applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object
Data Source
AI summary
A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.