Liquid Metal Chip Packaging Structure for Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current semiconductor packaging technologies suffer from poor heat dissipation due to the use of polymer thermal interface materials, leading to reduced performance.

Innovation Solution

A chip packaging structure utilizing a liquid metal thermal interface material sealed within an enclosure structure, combined with a heat sink member, and fixed using UV curing adhesive, to enhance thermal conductivity and prevent overflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymer thermal interface material is used, then the packaging structure is easy to manufacture, but the thermal conductivity is poor leading to poor heat dissipation

Engineering Contradiction:

Improveease of manufactureVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent changes the physical state of the thermal interface material from solid polymer to liquid metal, fundamentally altering the thermal conductivity parameter. Liquid metal provides superior thermal conduction while maintaining ease of application through filling processes, resolving the contradiction between manufacturability and heat dissipation performance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs liquid metal as a composite thermal interface material that combines high thermal conductivity with appropriate viscosity and wetting properties. This composite approach maintains ease of manufacture through standard filling techniques while achieving excellent heat dissipation, overcoming the limitations of pure polymer materials

Inventive Principle:

Principle #40Composite materials

2Temperature

If liquid metal is used as thermal interface material, then thermal conductivity improves, but the liquid metal may overflow during encapsulation

Engineering Contradiction:

Improvethermal conductivityVSAvoidoverflow prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies UV curing adhesive to the encapsulation structure before filling with liquid metal. This creates a pre-established sealing barrier that prevents liquid metal overflow during the encapsulation process, while still allowing the liquid metal to achieve its high thermal conductivity function

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The UV curing adhesive acts as an intermediary sealing layer between the encapsulation structure and the liquid metal. It provides a reliable barrier that contains the liquid metal, preventing overflow while allowing the thermal interface material to perform its heat dissipation function effectively

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If UV curing adhesive is used for sealing, then secure connection is achieved, but the replacement process requires additional curing steps

Engineering Contradiction:

Improvesecure connectionVSAvoidreplacement process

Core Design Contradiction:

StrengthVSEase of repair

Solution Approach 1:

The patent replaces traditional mechanical or thermal bonding methods with UV curing adhesive bonding. This provides secure connection through chemical bonding while enabling controlled replacement by using UV light exposure to cure or uncure the adhesive, making the replacement process more precise and controllable despite requiring additional curing steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves thermal diffusion efficiency and maintains electrical integrity by using liquid metal as the thermal interface material, with a flexible enclosure structure and UV adhesive ensuring secure connections and easy replacement.

Implementation Method 1

filling the sealed cavity with liquid metal to form a layer of thermal interface material disposed on the chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipation component is sealed and fixedly connected to the enclosure structure by a UV curing adhesive

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS20260090379A1Chip packaging structure and preparation method

Publication Date: 2026.03.26 SJ SEMICONDUCTOR (JIANGYIN) CORP

AI summary

A chip packaging structure includes, a chip on a substrate; an enclosure structure on the chip, a wall of the enclosure structure comprises a sealed cavity, and the chip is revealed through the sealed cavity; a layer of thermal interface material for the chip, formed by filling a liquid metal into the sealed cavity of the wall of the enclosure structure; and a heat sink, formed on the layer of thermal interface material, is hermetically sealed to the wall of the enclosure structure. The heat sink component is formed on the layer of the thermal interface material, sealed and connected to the enclosure structure. The enclosure structure using flexible materials to prevent the liquid metal from overflowing in the encapsulation and application process, thereby reducing degradation. The UV curing adhesive is used for sealing and fixing the connection to the thermal interface material layer, so the disassembly and replacement of the process is simpler.