Liquid Metal Thermal Interface for Warpage-Tolerant IC Packages

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Solution Overview

Problem

Warpage issues arise in integrated circuit packages due to material differences, worsening with package size increase, affecting heat dissipation and integration.

Innovation Solution

Incorporation of a permeable plate with liquid metal media that migrates through channels to conform to package surfaces, forming a composite thermal interface material for improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If package components are bonded together to increase integration level, then functionality and integration level are improved, but warpage occurs due to material differences

Engineering Contradiction:

Improveintegration levelVSAvoidwarpage

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

A liquid metal thermal interface material is introduced as an intermediary between package components and heat dissipation structures. This liquid metal adapts to warpage-induced surface irregularities, maintaining effective thermal contact despite shape changes in the bonded package components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes the phase change parameter of the thermal interface material, transitioning from a solid or semi-solid state during assembly to a liquid state during operation. This parameter change allows the material to flow and conform to warped surfaces, compensating for shape deviations while maintaining thermal conductivity.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If package size increases to provide more functionality, then integration level is improved, but warpage becomes more severe

Engineering Contradiction:

ImprovefunctionalityVSAvoidwarpage severity

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

The liquid metal thermal interface material performs self-adjustment by automatically flowing and redistributing itself in response to warpage. This self-service mechanism eliminates the need for additional compensation structures or active control systems to maintain thermal contact in large-scale packages.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent transitions from static thermal interface materials to a dynamic liquid metal that can continuously adapt its shape and distribution. This dynamic behavior allows the thermal interface to respond to and accommodate warpage that develops as package size increases.

Inventive Principle:

Principle #15Dynamics

3Ease of manufacture

If conventional thermal interface materials are used, then manufacturing is simple, but heat dissipation efficiency decreases due to voids and poor contact

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent replaces conventional mechanical compression methods for achieving thermal contact with a fluid-based system. The liquid metal's inherent flowability and ability to conform to surfaces eliminates the need for high compression forces and complex mechanical assembly processes, while simultaneously improving thermal contact and eliminating voids.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation by allowing the liquid metal to reshape and fill gaps, reducing warpage-related voids and improving thermal conductivity.

Implementation Method 1

the liquid metal migrates through the permeable plate to contact the lid and package components

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The liquid-metal-comprising media has a low melting point, and has the ability of melting when the package is operated (powered up). Accordingly, the liquid-metal-comprising media has the ability of reshaping itself to fit the shape of the surfaces

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

The heat dissipation from the package to the metal lid is thus improved

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12622274B2Packages with liquid metal as heat-dissipation media and method forming the same

Publication Date: 2026.05.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.