Lithographic Inter-Die Connections for High-Bandwidth Multi-Die Chips
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Solution Overview
Problem
Existing computer chip architectures are inadequate for efficiently processing large volumes of data required for advanced artificial intelligence and machine learning applications, leading to economic inefficiencies and suboptimal data processing capabilities.
Innovation Solution
An integrated circuit architecture with multiple interconnected die on a single substrate, featuring inter-die connections that enable direct communication and enhanced data processing, utilizing a lithography system to form conductive inter-die connections without dicing the die from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional separate computer systems or servers are used for data processing, then data processing capability can be scaled by adding more systems, but economic feasibility deteriorates due to high costs
Solution Approach 1:
The patent merges multiple separate computer systems into a single integrated multi-die system by forming inter-die connections between multiple semiconductor dies during fabrication. This consolidation achieves high data processing capability while reducing economic costs by eliminating the need for multiple separate systems, interconnect infrastructure, and associated overhead.
Solution Approach 2:
The patent transitions from scaling in the vertical dimension (adding more separate servers and systems) to scaling in the horizontal dimension (integrating multiple dies on a single substrate). This dimensional shift enables parallel data processing across multiple dies while maintaining economic feasibility through a single integrated package.
2Productivity
If modern remote distributed networked servers and onboard computer processors are used, then data processing can be performed, but efficiency deteriorates when handling large volumes of data for AI algorithms
Solution Approach 1:
The patent segments the data processing function across multiple semiconductor dies, with each die handling specific computational tasks. This segmentation enables parallel processing of large data volumes while maintaining high efficiency through direct inter-die connections, overcoming the limitations of distributed networked servers and traditional onboard processors for AI workloads.
3Quantity of substance
If multiple separate computers or servers are scaled to process large data sets, then data processing capacity increases, but system complexity and cost increase
Solution Approach 1:
The patent combines multiple computing units into a single integrated multi-die system with direct inter-die connections, increasing data processing capacity while reducing system complexity. The integrated architecture eliminates the need for complex external interconnects, multiple separate systems, and associated management overhead.
Data Source
AI summary
A semiconductor and a method of fabricating the semiconductor having multiple, interconnected die including: providing a semiconductor substrate having a plurality of disparate die formed within the semiconductor substrate, and a plurality of scribe lines formed between pairs of adjacent die of the plurality of disparate die; and fabricating, by a lithography system, a plurality of inter-die connections that extend between adjacent pair of die of the plurality of die.