Lithographic Support Table Protrusion Height Adjustment

The patent applies preliminary action by measuring protrusion heights and adjusting them to the correct height before substrate processing begins. The system pre-compensates for height deviations by removing material from protrusions that are too high, ensuring the substrate will be properly supported during lithography operations, thereby preventing overlay errors before they occur.

The patent replaces manual or traditional mechanical height adjustment methods with an automated material removal system. Instead of mechanically adding material or adjusting protrusions through complex mechanical means, the system uses controlled material removal (e.g., through abrasion or erosion processes) to precisely adjust protrusion heights, achieving better precision and repeatability.

The patent applies the taking out principle by separating the height adjustment function from the main support table structure. The adjustment mechanism is implemented as a distinct, modular component that can independently modify protrusion heights without affecting the core support table design. This modular approach reduces overall system complexity while achieving the desired surface flatness.

The system applies self-service by using the support table's own protrusions as the adjustment targets. Rather than introducing an entirely separate adjustment mechanism that acts on the substrate or support surface, the system directly adjusts the protrusions themselves, which are integral to the support table's function. This eliminates the need for additional complex intermediary mechanisms.