Load Lock Chamber Sequencing to Minimize Wafer Processing Vibration
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Solution Overview
Problem
Charged particle beam devices face challenges in achieving high throughput due to vibrations from mechanisms like pipe opening/closing valves and shutter operations, which result in waiting times and reduced precision during semiconductor wafer processing.
Innovation Solution
A semiconductor processing apparatus with a control mechanism that coordinates the operations of load lock chambers to minimize vibrations by performing vibration-generating operations in chambers not exchanging wafers with the sample chamber, thereby reducing waiting times and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pipe opening/closing valve operations are performed during wafer processing, then vacuum control is achieved, but vibrations occur causing waiting time and reduced throughput
Solution Approach 1:
The system divides the single load lock chamber into multiple load lock chambers (first and second load lock chambers), allowing vacuum control operations in one chamber while wafer processing occurs in another, thereby segmenting the functions to eliminate vibrations during processing
Solution Approach 2:
The sample exchange mechanism acts as an intermediary between the load lock chambers and the processing chamber, enabling coordinated operation where wafer transfer occurs during vibration-free periods while vacuum operations occur in parallel in separate chambers
2Ease of operation
If shutter operations are performed during wafer processing, then sample carry-in port control is achieved, but vibrations occur causing waiting time and reduced throughput
Solution Approach 1:
The system separates shutter operations into different chambers at different times - the first shutter operates in the first load lock chamber while the second shutter remains closed during wafer processing, eliminating vibration interference with the processing operation
3Productivity
If multiple load lock chambers are used to parallelize operations, then throughput is improved, but device complexity increases
Solution Approach 1:
Each load lock chamber is designed with identical multi-functional capabilities, serving as both a vacuum isolation chamber and a processing preparation chamber, allowing the system to handle multiple wafers through parallel operations while maintaining standardized chamber designs
Data Source
AI summary
A plurality of load lock chambers are provided, a predetermined valve device is controlled such that the valve device is not operated during wafer processing, a signal for permitting operation of the predetermined valve device is transmitted at a timing when the wafer processing is completed, and the valve device is operated based on the signal. Thus, while a processed wafer and an unprocessed wafer are exchanged between one load lock chamber and a processing chamber, an operation sequence of the entire semiconductor processing apparatus is controlled such that a predetermined valve device in the other load lock chamber is operated, and thus vibration does not occur during the operation of an electron optical system, thereby reducing a waiting time.