Material Analysis Using Wave/Particle Radiation TRIZ Cases
- Self-Differential Confocal Tilt Sensing for Rough Sample Leveling
A common-mode reference beam and confocal aperture improve tilt sensing on rough or slightly tilted samples in charged particle beam systems.
- Electron Microscopy Grid Functionalization With Temporary Reaction Chambers
Temporary reaction chambers segment an EM grid for multiple local functionalizations, reducing cross-contamination and improving imaging throughput.
- In-Situ Shutter Disk Metrology for Thin Film Deposition Control
Real-time shutter-disk metrology measures film thickness, resistance, and composition during deposition to improve uniformity and cut defects.
- X-Ray Fluorescence Power Supply Circuit for Zener Leakage Suppression
A voltage follower with Schottky and Zener diodes suppresses leakage current, keeping X-ray tube feedback aligned with actual tube current.
- Temperature-Dependent SEM Mapping for Dopant Distribution Analysis
By comparing SEM electron signals at different temperatures, this case derives dopant maps with higher spatial resolution and broader concentration detection.
- Secondary Battery Electrode Pore Mapping Using Silicon-Filled Polymer
Silicon-filled polymer and EDS mapping distinguish pores from electrode materials, enabling accurate pore distribution analysis in secondary batteries.
- Macrolamella Reorientation for Deep ROI Microsample Preparation
By reorienting a macrolamella for lateral beam removal, deep sample ROIs are exposed faster with less damage risk.
- Voltage Contrast Defect Detection With Dual-Mode Beam Apertures
Dual-mode beam apertures enable flooding and inspection while limiting Coulomb effects, preserving resolution and throughput in IC defect detection.
- Semiconductor Image Correction for Step-Height Defocus
Area-specific correction coefficients reduce defocus from step-height semiconductor patterns without repeated imaging, limiting damage and throughput loss.
- Battery Module Resin Injection Monitoring for Uniform Cooling
A detection agent in thermally conductive resin makes fill distribution visible, preventing leakage, waste, and uneven battery module cooling.
- Patterned X-Ray Target Structure for Beam Shaping and Heat Dissipation
A gold mask, active layer, and diamond substrate combine to shape X-ray emission while improving heat dissipation in XRS, XPS, and XRF.
- Elemental Mapping With Electron and Ion Beams for Light Elements
Combining X-ray mapping with ion-induced photon detection reveals light elements such as hydrogen and lithium in complete sample ROI maps.
- Electron Beam Pattern Measurement for Deep Etch Bottom Accuracy
By matching beam tilt to pattern inclination, this case improves bottom-dimension measurement in deep etched semiconductor features.
- Lamella Cutout Structure for Multi-Sample Grid Transport
Cutout lamella geometry enables multiple samples to mount on one grid without deposition, reducing contamination and protecting analysis regions.
- Cryo-EM Grid Edge Wicking for Uniform Ice Thickness
Edge-only wicking drains excess liquid from cryo-EM grids without full blotting, improving ice thickness consistency and sample repeatability.
- X-Ray Backscatter Collimator Alignment for Lower Energy Waste
An intensity sensor over the detection aperture guides x-ray emission alignment, cutting collimation losses and improving part inspection efficiency.
- Ion Beam Delayering With Topography for IC Imaging Contrast
Selective ion milling creates ridges and edges on delayered IC layers, improving SEM contrast for clearer material and connection analysis.
- Schottky TFE Tip Inspection Using Collimated Electron Beam Imaging
Electron optics and a scintillator screen enable high-resolution Schottky TFE tip images for defect detection and emission pattern inspection.
- Hybrid Carbon Anode Analysis Using XRD Capacity Separation
XRD tracking of lattice d-spacing separates carbon and non-carbon anode capacity contributions to pinpoint battery degradation causes.
- Reactive Material Sample Lift-Out Using Redeposition Bonding
Milled support material redeposits to bond highly reactive samples without precursor gases, reducing contamination and surface damage.
- Load Lock Chamber Sequencing to Minimize Wafer Processing Vibration
Coordinated load lock valve and shutter timing shifts vibration-generating steps away from wafer processing to cut waiting time and raise throughput.
- Semiconductor Layer-by-Layer SEM X-Ray Imaging for 3D Resolution
Layered SEM probing with FIB preparation and X-ray deconvolution improves 3D semiconductor structure and elemental analysis.
- XPS Metrology for Selective Deposition Process Control
XPS spectra quantify passivation quality and deposition selectivity, enabling faster drift detection and process control in selective deposition.