Reactive Material Sample Lift-Out Using Redeposition Bonding
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Solution Overview
Problem
Current charged particle microscopy systems face challenges in attaching and manipulating highly reactive materials due to contamination risks, complex processing steps, and potential sample degradation from traditional precursor gases or liquids, which limits their suitability for sensitive samples.
Innovation Solution
The method involves creating a nesting void in a support structure and milling material from it to form attachment bonds with the sample without using precursor gases, allowing for sample lift-out and protective cap placement, enabling imaging and analysis techniques like serial sectioning tomography and electron backscatter diffraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional precursor gases are used to attach samples to the support structure, then the sample can be attached and manipulated, but the highly reactive sample surface degrades and becomes more reactive to charged particle beams
Solution Approach 1:
The invention extracts and eliminates the harmful precursor gas step from the sample attachment process. Instead of introducing external precursor gases that degrade the sample surface, the method uses direct deposition of material from the support structure onto the sample through controlled milling and redeposition, achieving attachment without contaminating the highly reactive sample surface
Solution Approach 2:
The invention introduces a intermediate deposition layer formed from the support structure's own material that acts as a mediator between the sample and the support structure. This intermediate layer, created by milling and redeposition, provides the attachment bond without requiring external precursor gases that would harm the sample surface
2Reliability
If precursor gases or liquids are introduced to the chamber for sample attachment, then attachment bonds can be formed, but contamination of optical components and unwanted deposits on the sample increase
Solution Approach 1:
The invention extracts the source of contamination by eliminating the introduction of external precursor gases and liquids into the chamber. The attachment process uses only material from the support structure itself, which is milled and redeposited locally, preventing contamination of optical components and unwanted deposits on the sample
Solution Approach 2:
The support structure serves itself by providing the material that will be deposited to form the attachment bond. Through controlled milling of the support structure and redeposition of its own material onto the sample, the system achieves attachment without requiring external materials that would contaminate the chamber
3Reliability
If complex precursor gas introduction mechanisms are implemented, then sample attachment can be achieved, but the system design and implementation complexity increases
Solution Approach 1:
The invention extracts and removes the complex gas introduction mechanisms from the system. By using a process that relies on milling and redeposition of material from the support structure itself, the method eliminates the need for precursor gas delivery systems, simplifying the overall system design and implementation
Solution Approach 2:
The invention replaces the mechanical and chemical systems required for precursor gas introduction with a purely physical process of milling and redeposition. This substitution eliminates complex gas handling mechanisms while achieving the same attachment function through controlled material removal and deposition
4Ease of operation
If traditional attachment methods are used, then samples can be prepared and manipulated, but additional complex processing steps are required that are difficult for new users to implement
Solution Approach 1:
The invention extracts the complex multi-step processing procedures from the sample preparation workflow. By using a single integrated process of milling the support structure and allowing material redeposition to form attachment bonds, the method reduces the number of processing steps and makes the system easier to operate for new users
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the safe attachment and investigation of highly reactive materials without sample damage, reducing contamination and complexity, and enabling high-quality imaging and analysis.
Implementation Method 1
milling material from a region of the support structure that defines the nesting void
Implementation Method 2
at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure
Data Source
AI summary
Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.