Load Reduced Memory Module Buffer Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-speed data transfer in memory modules leads to signal quality degradation due to increased load capacity on motherboard data lines, which conventional memory modules struggle to maintain with single register buffers, resulting in costly solutions like Advanced Memory Buffers and compatibility issues with memory controllers.
Innovation Solution
A memory module configuration with multiple data register buffers and a separate command/address/control register buffer, each assigned to multiple memory chips, reduces line length and enhances signal quality, allowing for high-speed data transfer while maintaining compatibility with conventional memory controllers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single register buffer is used in a Load Reduced memory module, then cost is reduced and compatibility with conventional memory controllers is maintained, but signal quality degrades at high data transfer rates
Solution Approach 1:
The memory module is divided into multiple independent buffer units, with each buffer unit assigned to serve multiple memory chips. This segmentation allows the system to maintain signal quality by reducing the number of chips per buffer while keeping the overall buffer count lower than a fully buffered approach, thus balancing cost and performance.
Solution Approach 2:
Each buffer unit is designed to serve multiple memory chips simultaneously, making the buffer multi-functional. This universal approach reduces the total number of buffers needed compared to a one-to-one mapping, lowering cost while maintaining acceptable signal quality through reduced load per buffer.
2Quantity of substance
If multiple memory modules are mounted on a motherboard to increase memory capacity, then memory capacity requirement is met, but load capacity of data lines increases causing signal quality degradation
Solution Approach 1:
The data path is segmented by introducing buffer units between the memory controller and memory chips. Each buffer isolates the memory controller from the cumulative load of multiple memory chips and modules, allowing multiple modules to be mounted without proportionally increasing the load on the memory controller's data lines.
3Productivity
If data transfer rate is increased to meet high-speed requirements, then productivity is improved, but signal quality degrades due to increased load capacity
Solution Approach 1:
The buffer units provide dynamic signal conditioning and timing adjustment capabilities, allowing the system to maintain signal quality at high data transfer rates by adaptively managing the electrical load and signal integrity conditions on the data lines.
Data Source
AI summary
A memory module includes a plurality of memory chips, a plurality of data register buffers, and a command/address/control register buffer mounted on a module PCB. The data register buffers perform data transfers with the memory chips. The command/address/control register buffer performs buffering of a command/address/control signal and generates a control signal. The buffered command/address/control signal is supplied to the memory chips, and the control signal is supplied to the data register buffers. According to the present invention, because line lengths between the data register buffers and the memory chips are shortened, it is possible to realize a considerably high data transfer rate.