Location-Based Bus Termination for Multi-Core Processors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bus architectures are limited in supporting multi-core processor environments, as they require active impedance control without provisions for multi-core processors, leading to issues like high frequency noise, reflections, and timing displacements due to parallel termination impedances.
Innovation Solution
A location-based multi-core/multi-package bus termination apparatus is introduced, featuring a first node, location array, and drivers within each processor core to dynamically control bus termination impedance based on the physical location of nodes on the bus, enabling pull-up and pull-down logic to maintain proper impedance and minimize transmission line effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional bus architectures with point-to-point interface are used, then fast incident wave switching with low output swing is achieved, but multi-processor environment support is limited
Solution Approach 1:
The patent implements dynamic termination impedance control where each processor core can independently adjust its termination impedance based on its location on the bus. The system transitions from static point-to-point termination to dynamic multi-point termination, allowing the bus architecture to adapt its termination characteristics based on the number and position of connected processors, thereby supporting multi-processor environments while maintaining signal integrity
Solution Approach 2:
The patent applies different termination impedance values to different processor cores based on their specific locations on the bus. Each core has independent termination control circuits that adjust impedance locally according to whether the core is at an end position or intermediate position, creating localized optimization rather than uniform termination across all processors
2Adaptability or versatility
If multiple processors are interfaced in parallel to a memory controller, then multi-processor application requirements are met, but high frequency noise, reflections, and timing displacements occur due to parallel termination impedances
Solution Approach 1:
The patent changes the termination impedance parameter dynamically based on processor location. End-position processors use one termination impedance value while intermediate-position processors use a different value, optimizing signal characteristics for each location and reducing reflections and noise across the multi-processor bus environment
Solution Approach 2:
The patent implements location-specific termination control where each processor core has independent termination circuits configured according to its position on the bus. This local optimization reduces signal integrity issues by tailoring termination characteristics to the specific electrical characteristics of each position on the bus
3Reliability
If active termination impedance control is implemented without location-based differentiation, then bus termination is controlled, but multi-core/multi-package configurations experience transmission line effects
Solution Approach 1:
The patent implements location-based termination control where each processor core independently determines its position on the bus and adjusts its termination impedance accordingly. End-position cores enable pull-up logic while intermediate-position cores disable it, creating locally optimized termination that eliminates transmission line effects in multi-core/multi-package configurations
Solution Approach 2:
The system dynamically adjusts termination impedance based on real-time detection of processor location. The multi-processor logic continuously monitors bus configuration and adjusts termination settings accordingly, transitioning from static to dynamic termination control that adapts to the specific multi-core/multi-package configuration
Data Source
AI summary
A multi-core/multi-package bus termination apparatus includes a first node, a location array, and a plurality of drivers. The first node receives a signal indicating whether a package upon which the processor core is disposed is internal to the bus or at a far end of the bus. The location array generates location signals indicating locations on the bus of nodes, where the locations are either an internal location or a bus end location. The drivers control how the nodes are driven. Each drivers has location-based multi-core/multi-package logic. The location-based multi-core/multi-package logic enables pull-up logic and first pull-down logic responsive to states of the first node ad the location signals.