Long-Range Sensor Package with Light-Shielding Shoulder

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Solution Overview

Problem

Conventional package structures for long-distance sensors have a shorter sensing distance and lower sensing accuracy due to the separation of mold-formed holes from lens portions, allowing external optical noise to interfere with the sensor's performance.

Innovation Solution

A package structure for long-distance sensors that includes a substrate with a light-emitting chip and a sensing chip covered by packaging gel bodies with lens and shoulder portions, a cap accommodating these features, and sheltering means on the shoulder portions to block external light, increasing the sensing distance and accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the cap is formed by molding with light-emitting hole and light-receiving hole, then the packaging process is accomplished, but the internal walls of the holes are separated from the lens portions by an interval causing shorter sensing distance

Engineering Contradiction:
Improvepackaging process completionVSAvoidsensing distance
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent introduces a reflective layer as an intermediary element positioned between the cap's internal wall and the lens portion. This reflective layer extends into the light-emitting hole and light-receiving hole, effectively bridging the gap created by the molded cap structure. The reflective layer redirects light that would otherwise be lost in the interval, thereby extending the effective sensing distance while maintaining the ease of molded packaging production.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the cap is formed by molding, then the packaging structure is simplified, but exterior optical noise can enter the sensor lowering sensing accuracy

Engineering Contradiction:
Improvepackaging structure complexityVSAvoidsensing accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The reflective layer serves as an intermediary optical element that not only extends the sensing distance but also functions as a selective light guide. It reflects desired signal light into the sensor while the shoulder portions and sheltering means block external optical noise. This maintains the simple molded cap structure while improving sensing accuracy through optical optimization.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different optical properties to different regions: the reflective layer provides high reflectivity in the hole regions to guide signal light, while the shoulder portions maintain transparency or different optical characteristics. This local differentiation of optical properties allows the structure to simultaneously achieve noise rejection and accurate sensing without increasing overall complexity.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If sheltering means are added on shoulder portions to block light, then sensing accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvesensing accuracyVSAvoidpackaging structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sheltering means are merged with the existing shoulder portions of the packaging gel bodies. Rather than adding completely separate components, the sheltering function is integrated into the structural elements already present in the package. This combination approach blocks external light while minimizing increases in device complexity by utilizing existing structural features.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sheltering means effectively reduce external optical noise interference, enhancing the sensing distance and accuracy of the long-distance sensor.

Implementation Method 1

The top surface of each of the packaging gel bodies is formed with a lens portion... the light-emitting hole and the light-receiving hole accommodate the lens portions

Methodology Applied
Scientific EffectLight transmission and focusing: Lens

Implementation Method 2

The two sheltering means are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions

Methodology Applied
Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS10090427B2Package structure of long-distance sensor and packaging method of the same
Publication Date: 2018.10.02 LINGSEN PRECISION IND LTD
  • US10090427B2 patent drawing
  • US10090427B2 patent drawing
  • US10090427B2 patent drawing

AI summary

A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering devices. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The top surface of each of the packaging gel bodies is formed with a lens portion and a shoulder portion. The cap is formed on the bearing surface and the packaging gel bodies and provided with a light-emitting hole and a light-receiving hole accommodating the lens portions and the shoulder portions of the top surfaces of the packaging gel bodies respectively. The two sheltering devices are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions.