Long-Range Sensor Package with Light-Shielding Shoulder
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional package structures for long-distance sensors have a shorter sensing distance and lower sensing accuracy due to the separation of mold-formed holes from lens portions, allowing external optical noise to interfere with the sensor's performance.
Innovation Solution
A package structure for long-distance sensors that includes a substrate with a light-emitting chip and a sensing chip covered by packaging gel bodies with lens and shoulder portions, a cap accommodating these features, and sheltering means on the shoulder portions to block external light, increasing the sensing distance and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the cap is formed by molding with light-emitting hole and light-receiving hole, then the packaging process is accomplished, but the internal walls of the holes are separated from the lens portions by an interval causing shorter sensing distance
Solution Approach 1:
The patent introduces a reflective layer as an intermediary element positioned between the cap's internal wall and the lens portion. This reflective layer extends into the light-emitting hole and light-receiving hole, effectively bridging the gap created by the molded cap structure. The reflective layer redirects light that would otherwise be lost in the interval, thereby extending the effective sensing distance while maintaining the ease of molded packaging production.
2Device complexity
If the cap is formed by molding, then the packaging structure is simplified, but exterior optical noise can enter the sensor lowering sensing accuracy
Solution Approach 1:
The reflective layer serves as an intermediary optical element that not only extends the sensing distance but also functions as a selective light guide. It reflects desired signal light into the sensor while the shoulder portions and sheltering means block external optical noise. This maintains the simple molded cap structure while improving sensing accuracy through optical optimization.
Solution Approach 2:
The patent applies different optical properties to different regions: the reflective layer provides high reflectivity in the hole regions to guide signal light, while the shoulder portions maintain transparency or different optical characteristics. This local differentiation of optical properties allows the structure to simultaneously achieve noise rejection and accurate sensing without increasing overall complexity.
3Measurement precision
If sheltering means are added on shoulder portions to block light, then sensing accuracy is improved, but device complexity increases
Solution Approach 1:
The sheltering means are merged with the existing shoulder portions of the packaging gel bodies. Rather than adding completely separate components, the sheltering function is integrated into the structural elements already present in the package. This combination approach blocks external light while minimizing increases in device complexity by utilizing existing structural features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheltering means effectively reduce external optical noise interference, enhancing the sensing distance and accuracy of the long-distance sensor.
Implementation Method 1
The top surface of each of the packaging gel bodies is formed with a lens portion... the light-emitting hole and the light-receiving hole accommodate the lens portions
Implementation Method 2
The two sheltering means are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions
Data Source
AI summary
A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering devices. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The top surface of each of the packaging gel bodies is formed with a lens portion and a shoulder portion. The cap is formed on the bearing surface and the packaging gel bodies and provided with a light-emitting hole and a light-receiving hole accommodating the lens portions and the shoulder portions of the top surfaces of the packaging gel bodies respectively. The two sheltering devices are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions.


