Loop Heat Pipe Assembly for Multi-Source Cooling and Vapor Backflow Blocking
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Solution Overview
Problem
Existing heat dissipation technologies for electronic devices, such as mobile phones and tablets, face challenges in efficiently dissipating heat from multiple heat sources without increasing device size or incurring high manufacturing costs, particularly when using loop heat pipes with gas-liquid separation structures.
Innovation Solution
A loop heat pipe design with at least two evaporation cavities separated by a partition and equipped with capillary structures that form an anti-backflow mechanism, allowing separate heat dissipation from multiple heat sources while reducing manufacturing costs through efficient gas-liquid separation and vapor management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a loop heat pipe with gas-liquid separation structure is used to dissipate heat from multiple heat sources, then heat dissipation efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple evaporation cavities into a single integrated heat pipe structure with shared condensation and liquid replenishment systems. The housing component contains multiple evaporation cavities that are fluidly connected to common condensation cavities through shared pipelines, allowing multiple heat sources to be dissipated through one unified heat pipe rather than requiring separate heat pipes for each heat source.
Solution Approach 2:
The heat pipe structure is designed with multi-functionality where a single heat pipe system serves multiple heat dissipation purposes. The condensation cavities and liquid replenishment passages are shared across multiple evaporation cavities, enabling the same structural components to perform multiple functions of condensing vapor from different evaporation zones and replenishing liquid to multiple locations simultaneously.
2Reliability
If separate loop heat pipes are used for each heat source, then heat dissipation effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
Multiple heat dissipation functions are merged into a single heat pipe component. The housing component integrates multiple evaporation cavities, shared condensation cavities, and common liquid replenishment passages, replacing what would traditionally require multiple separate heat pipe assemblies. This consolidation reduces the number of parts that need to be manufactured, assembled, and sealed.
Solution Approach 2:
The heat pipe structure is designed as a universal component that can handle heat dissipation from multiple heat sources simultaneously. The shared pipelines and condensation cavities serve multiple evaporation cavities, creating a multi-functional heat dissipation system that reduces overall manufacturing complexity and cost compared to using dedicated single-function heat pipes for each heat source.
3Reliability
If vapor backflow occurs in the liquid replenishment passage, then heat dissipation performance deteriorates, but preventing backflow increases structural complexity
Solution Approach 1:
The patent introduces a vapor barrier layer as an intermediary substance in the liquid replenishment passage. This vapor barrier layer acts as a mediator that selectively allows liquid to pass through while blocking vapor from flowing backward. The vapor barrier layer is disposed at specific locations in the liquid replenishment passage to create directional flow control without requiring mechanical valves or complex anti-backflow mechanisms.
Solution Approach 2:
The patent replaces potential mechanical anti-backflow structures (such as check valves or complex gating mechanisms) with a vapor barrier layer that provides backflow prevention through material properties rather than mechanical action. This substitution simplifies the structure by using a passive barrier layer instead of active mechanical components to control vapor flow direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The loop heat pipe effectively dissipates heat from multiple heat sources, prevents vapor backflow, and reduces manufacturing costs, thereby improving heat dissipation performance and preventing local overheating in electronic devices.
Implementation Method 1
At least part of the first capillary structure is disposed in the liquid replenishment passage and at least two evaporation cavities
Implementation Method 2
a loop heat pipe is provided, including a housing component, a first capillary structure and a second capillary structure... The loop heat pipe effectively dissipates heat from multiple heat sources
Implementation Method 3
The second capillary structure includes first bodies that correspond to the evaporation cavities on a one-to-one basis. At least one of the first bodies blocks the liquid replenishment port of the corresponding evaporation cavity
Data Source
AI summary
A loop heat pipe includes a housing component, a first capillary structure and a second capillary structure. The housing component is provided with a pipeline unit, a first partition part and at least two evaporation cavities. The evaporation cavity includes a vapor outlet communicated with one end of the pipeline unit and a liquid replenishment port communicated with the other end of a liquid replenishment passage. At least part of the first capillary structure is disposed in the liquid replenishment passage and the evaporation cavities. The second capillary structure is disposed in at least one of the replenishment passage and the evaporation cavities. The second capillary structure includes first bodies that correspond to the evaporation cavities on a one-to-one basis. The first bodies block the liquid replenishment ports of the corresponding evaporation cavities.