Loop Heat Pipe Gas Discharge Structure for Backflow Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current loop heat pipes face inefficiencies in heat dissipation, particularly in preventing gas backflow and optimizing heat transfer, which affects the stability and performance of electronic components in devices like mobile phones and laptops.
Innovation Solution
The loop heat pipe one-way circulation device incorporates a gas storage chamber and fluid guiding block to increase gas discharge pressure, prevent backflow, and enhance heat dissipation efficiency, with a gas storage chamber active section to control gas flow and optimize performance based on needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If loop heat pipe is used for heat dissipation, then heat transfer efficiency is improved, but gas backflow occurs reducing system reliability
Solution Approach 1:
The patent extracts the gas accumulation problem from the heat dissipation system by introducing a separate gas storage chamber that collects non-condensable gases away from the heat absorption area. This separation allows the heat dissipation function to operate efficiently while the gas storage chamber handles gas accumulation, preventing backflow into the heat pipe circulation path.
Solution Approach 2:
The gas storage chamber acts as an intermediary component between the heat absorption area and the heat dissipation system. It mediates the gas accumulation issue by providing a dedicated space for non-condensable gases, preventing them from interfering with the heat transfer process while maintaining system pressure balance.
2Reliability
If gas storage chamber is added to prevent backflow, then system reliability is improved, but device complexity increases
Solution Approach 1:
The gas storage chamber is merged with the upper casing structure, integrating the gas storage function into the existing heat pipe housing rather than adding a completely separate component. This integration reduces overall device complexity while maintaining the gas storage functionality needed to prevent backflow and improve reliability.
3Reliability
If gas discharge cavity height is increased to store more gas, then backflow prevention is improved, but device volume increases
Solution Approach 1:
The gas storage chamber utilizes the vertical dimension (height) of the upper casing to provide gas storage capacity. By designing the gas discharge cavity height to be greater than the heat absorption area inner surface height, the patent stores gas in the vertical space above the heat absorption area, avoiding the need to increase the horizontal footprint of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by increasing gas discharge pressure and preventing backflow, thereby enhancing the reliability and stability of electronic components by effectively managing heat transfer in electronic devices.
Implementation Method 1
the loop heat pipes have functions such as high heat transfer, long-distance heat transport and low thermal resistance
Implementation Method 2
the heat absorption area is formed between the fluid inlet and the fluid outlet
Data Source
AI summary
A loop heat pipe one-way circulation device includes a lower cover plate and an upper casing closely connected to the lower cover plate. The upper casing includes a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is in close contact with the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. In addition, the heat absorption area includes a heat absorption area inner surface height, and the gas discharge cavity has a gas discharge cavity height, and the gas discharge cavity height is greater than the heat absorption area inner surface height.