Low Compressive TiNx Layer for MEMS Structural Stability
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Solution Overview
Problem
Microelectromechanical devices require materials that are both electrically and mechanically superior, but common conductive materials lack the necessary mechanical strength and creep resistance, especially for deformable or deflectable elements like hinges and mirror plates in micromirror devices.
Innovation Solution
A low compressive TiNx layer with specific stress and composition, incorporating oxygen between 0-15%, is deposited using reactive sputtering with low power and high argon-to-nitrogen gas ratios to create a mechanically robust and electrically conductive material for deformable elements in microelectromechanical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TiNx layer with high compressive stress is deposited, then electrical conductivity is achieved, but structural stability deteriorates due to curvature and buckling
Solution Approach 1:
The patent applies preliminary anti-action by depositing TiNx material with controlled low compressive stress to counteract the formation of unwanted curvature and buckling. By pre-establishing the correct stress state during deposition, the structural layers maintain flatness and stability, preventing the harmful deformation that would otherwise occur in high-stress TiNx layers.
2Strength
If TiNx material is used for deformable elements, then mechanical strength is improved, but fabrication complexity increases due to stress control requirements
Solution Approach 1:
The patent performs preliminary action by establishing the correct deposition parameters and stress control measures during the TiNx material deposition process itself. By pre-determining the optimal sputtering conditions, gas ratios, and power levels, the complex stress control requirements are built into the fabrication process from the beginning, rather than requiring additional post-processing steps to manage stress issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TiNx layer achieves reduced stress and enhanced mechanical properties, preventing curvature and buckling, while maintaining electrical conductivity, thus improving the reliability and performance of deformable elements in microelectromechanical devices.
Implementation Method 1
The TiNx layer is deposited using reactive sputtering with a low sputtering rate and low sputtering power
Data Source
AI summary
Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.