Low Dielectric Resin Composition for Drilling and Copper Plating
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Solution Overview
Problem
Substrates made of fluororesin face challenges in drilling and copper plating due to poor processability, leading to high manufacturing costs and limited practical applications, while hollow glass beads in thermosetting resins cause poor plated copper uniformity and increased dielectric loss.
Innovation Solution
A low dielectric resin composition comprising a polyphenylene ether resin, vinyl-containing elastomer, hollow spherical silica, and halogen-free flame retardant, with specific gravity and particle size, to achieve low dielectric properties and improved processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If fluororesin substrates are used, then low dielectric constant is achieved, but drilling and copper plating processability deteriorates
Solution Approach 1:
The patent changes the material composition parameters by replacing fluororesin with a specific resin system consisting of polyphenylene ether resin (10-60 wt%), crosslinking agent (5-30 wt%), and vinyl-containing elastomer (20-50 wt%). This parameter change maintains low dielectric constant while significantly improving drilling and copper plating processability, as the new resin system has better mechanical properties and chemical stability compared to fluororesin.
Solution Approach 2:
The patent uses a composite resin system combining multiple components: polyphenylene ether resin as the base, crosslinking agent for network formation, and vinyl-containing elastomer for flexibility and processability. This composite material achieves both low dielectric constant and excellent processability, resolving the contradiction between electrical performance and manufacturing ease.
2Quantity of substance
If hollow glass beads are introduced into thermosetting resin substrate, then dielectric constant is reduced, but plated copper uniformity deteriorates and dielectric loss factor increases
Solution Approach 1:
The patent changes the filler material parameter from hollow glass beads to hollow spherical silica with specific gravity between 0.4-0.6 g/cm³ and controlled particle size distribution. This parameter change reduces dielectric constant while maintaining plated copper uniformity and controlling dielectric loss factor, as hollow spherical silica provides better surface uniformity and chemical stability compared to hollow glass beads.
Solution Approach 2:
The patent applies local quality by carefully controlling the particle size distribution of hollow spherical silica (D10-D90 ratio) and its surface properties. The specific particle size range (D50: 2.0-3.0 μm) and controlled polydispersity ensure uniform distribution in the resin matrix, which maintains plated copper uniformity while achieving low dielectric constant.
3Quantity of substance
If fluororesin substrates are used, then low dielectric constant is achieved, but manufacturing cost increases due to special equipment requirements
Solution Approach 1:
The patent changes the resin system parameters to use polyphenylene ether resin with standard processing characteristics, eliminating the need for special fluororesin processing equipment. This parameter change maintains low dielectric constant while significantly reducing manufacturing cost, as the new resin system can be processed using conventional thermosetting resin manufacturing equipment and processes.
Solution Approach 2:
The patent replaces expensive fluororesin materials with more cost-effective polyphenylene ether resin and hollow spherical silica fillers. This substitution maintains the required electrical performance while reducing material cost and eliminating the need for expensive special processing equipment, thereby reducing overall manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures stable performance with low transmission loss, good fluidity, and excellent drilling machinability, reducing costs and enhancing copper plating quality, suitable for millimeter wave applications.
Implementation Method 1
The hollow spherical silica has a specific gravity between 0.4 g/cm3 and 0.6 g/cm3 and an average particle size (D50) between 2.0 μm and 3.0 μm. In the low dielectric resin composition, with respect to 100 phr of the resin system, an amount of the hollow spherical silica ranges from 5 phr to 15 phr.
Implementation Method 2
component (D) of a coupling agent... an amount of the coupling agent ranges from 0.1 phr to 5 phr
Data Source
AI summary
A low dielectric resin composition for improvement of processability includes a resin system, a halogen-free flame retardant, hollow spherical silica, and a coupling agent. The resin system includes a polyphenylene ether resin, a crosslinking agent, and a vinyl-containing elastomer which are each added in a specific weight percentage. The hollow spherical silica has a specific gravity between 0.4 g/cm3 and 0.6 g/cm3 and an average particle size (D50) between 2.0 μm and 3.0 μm. Therefore, the low dielectric resin composition after being cured has a dielectric constant (Dk) between 2.75 and 3.05 and a dielectric loss factor (Df) of less than 0.002 at 10 GHz. Based on the above, a prepreg and a metal clad laminate applying the low dielectric resin composition are further provided.