Low-Power Temperature Sensing for Main Processor Circuits
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Solution Overview
Problem
Existing methods for measuring the temperature of integrated circuit devices are not accurate, leading to a need for an improved system and method for temperature measurement in electronic circuit devices.
Innovation Solution
An electronic circuit device with a temperature measurement module that generates an oscillation signal with an oscillation frequency corresponding to the temperature of the main processor module, driven at a low power consumption value and with a thermal resistance between the modules being a predetermined value or less, allowing for precise temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature measurement module is integrated into the electronic circuit device, then temperature measurement capability is achieved, but measurement precision is insufficient
Solution Approach 1:
The patent introduces a dedicated temperature measurement module as an intermediary component between the main processor and the external environment. This separate module specifically designed for temperature sensing acts as a mediator that accurately captures thermal information without interfering with the main processor's operation, thereby resolving the contradiction between achieving measurement capability and ensuring measurement precision.
Solution Approach 2:
The electronic circuit device is segmented into functionally independent modules: a main processor module for computation and a separate temperature measurement module for thermal sensing. This segmentation allows each module to be optimized for its specific function, with the temperature module dedicated solely to accurate temperature measurement, thus improving both measurement precision and reliability.
2Speed
If the temperature measurement module is driven at high power consumption, then measurement speed and responsiveness improve, but power consumption increases
Solution Approach 1:
The temperature measurement module operates using periodic action by alternately switching between measurement modes and low-power states. The module performs temperature measurements at specific intervals rather than continuously, allowing it to maintain measurement responsiveness when needed while significantly reducing average power consumption during normal operation.
Solution Approach 2:
The power consumption of the temperature measurement module is made dynamic rather than static. The module can adjust its operating state based on system requirements, transitioning between high-power measurement modes for rapid temperature changes and low-power modes for stable conditions, thereby optimizing the balance between measurement speed and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement of the main processor module within the electronic circuit device, reducing temperature measurement margin and allowing for more appropriate design specifications based on the use environment.
Implementation Method 1
a temperature measurement module (a thermometer) configured to generate an oscillation signal having an oscillation frequency in correspondence with a temperature of the main processor module
Data Source
AI summary
A temperature of an electronic circuit device such as an integrated circuit is measured with high accuracy. The electronic circuit device (10) includes a main processor (20) and a temperature measurement module (30). The main processor (20) can execute predetermined signal processing. The temperature measurement module (30) generates a signal having a correspondence relationship with the temperature of the main processor (20) under a mode in which the temperature measurement module is driven at a predetermined low power consumption or less and the thermal resistance between the temperature measurement module and the main processor (20) is a predetermined thermal resistance value or less.