LTCC LED Package With Protruding Metal Slug
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Solution Overview
Problem
Conventional high power LED package structures face challenges due to high costs and thermal issues associated with high temperature co-fired ceramic (HTCC) packages, limiting their development and efficiency.
Innovation Solution
The use of a Low Temperature Co-fired Ceramic (LTCC) technique for the LED package structure, featuring a chip carrier with a metal slug that protrudes from the accommodating hole and an extending portion to increase the mounting surface area, allowing for the application of LED chips of different sizes, and incorporating a ceramic reflective plate for enhanced light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high temperature co-fired ceramic (HTCC) package is used, then heat dissipation and structural stability are improved, but manufacturing cost and processing temperature requirements increase significantly
Solution Approach 1:
The patent changes the firing temperature parameter from high temperature (HTCC) to low temperature (LTCC), specifically using a co-fired temperature of 850-950°C. This parameter change maintains the structural stability and heat dissipation capabilities while significantly reducing manufacturing cost and processing complexity
Solution Approach 2:
The patent uses composite materials consisting of ceramic substrates combined with metal slugs and conducting paste. This composite structure provides both the thermal management capabilities of ceramics and the electrical conductivity of metals, achieving heat dissipation functionality at lower processing temperatures
2Adaptability or versatility
If metal slug is made to protrude from accommodating hole, then mounting surface area is increased for different LED chip sizes, but structural complexity increases
Solution Approach 1:
The patent extends the metal slug in the vertical dimension by creating an extending portion that protrudes from the accommodating hole. This dimensional extension provides additional mounting surface area without requiring changes to the horizontal footprint, enabling compatibility with different LED chip sizes while maintaining a relatively simple overall structure
Solution Approach 2:
The metal slug is segmented into two functional portions: a main body portion within the accommodating hole for structural support and electrical connection, and an extending portion protruding from the hole for LED chip mounting. This segmentation allows each portion to fulfill specific functions independently
Data Source
AI summary
An LED package structure includes a chip carrier and an LED chip. The chip carrier includes a ceramic substrate, a circuit layer, a ceramic reflective plate disposed on the ceramic substrate, and a metal slug. The ceramic substrate has a first thru-hole. A main portion of the metal slug is embedded in the first thru-hole, and partially protrudes from the first thru-hole with a height of 10˜30 μm to define as a protrusion block. An extending portion of the metal slug is connected to the outer edge of protrusion block, and the top surfaces of extending portion and protrusion block are coplanar to define a mounting surface. The ceramic reflective plate has a second thru-hole, and the mounting surface is exposed from the ceramic reflective plate via the second thru-hole. The LED chip is fixed on the mounting surface and is electrically connected to the circuit layer.