LTCC Sheet Chip Arrangement Thermal Resistance Reduction
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Solution Overview
Problem
Chip packages with back side isolation exhibit poorer heat dissipation due to higher thermal resistance compared to those without isolation, and Low Temperature Co-fired Ceramic (LTCC) sheets have relatively poor thermal conductivity, often requiring additional thermal management solutions.
Innovation Solution
A chip arrangement that includes a carrier with at least one chip and contact pad, surrounded by an encapsulation material, and features a low temperature co-fired ceramic sheet disposed over the carrier's side, which improves thermal conductivity and reduces thermal resistance by using LTCC sheets with enhanced adhesion and co-firing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If back side isolation with encapsulation material is used, then chip package structure is protected and isolated, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent changes the material parameter of the back side isolation from conventional encapsulation material to LTCC material, which has superior thermal conductivity properties. This parameter change allows the isolation layer to maintain protective functions while significantly improving heat dissipation performance by conducting heat away from the chip more effectively.
Solution Approach 2:
The patent employs LTCC (Low Temperature Co-fired Ceramic) material as a composite solution that combines the benefits of both structural isolation and thermal management. The LTCC material integrates the protective isolation function with high thermal conductivity, creating a multi-functional component that simultaneously provides mechanical protection and thermal pathways.
2Temperature
If LTCC sheets are used to improve thermal conductivity, then heat dissipation performance improves, but LTCC material has relatively poor thermal conductivity compared to other materials
Solution Approach 1:
The patent applies LTCC material specifically at the back side of the chip package where thermal management is most critical. By concentrating the high thermal conductivity material in the heat dissipation pathway rather than using it throughout the entire package, the solution optimizes thermal performance while minimizing manufacturing complexity and cost.
3Ease of manufacture
If conventional encapsulation material is used for back side isolation, then manufacturing is simple, but thermal resistance is high and heat dissipation is poor
Solution Approach 1:
The patent changes the material parameter from conventional encapsulation material to LTCC material, transforming the thermal properties of the back side isolation layer. This material substitution maintains the protective isolation function while dramatically improving thermal conductivity and heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chip arrangement achieves improved heat dissipation by leveraging the higher thermal conductivity of LTCC sheets, reducing thermal resistance and enabling more efficient heat management compared to traditional mold compound isolation materials.
Implementation Method 1
The chip arrangement achieves improved heat dissipation by leveraging the higher thermal conductivity of LTCC sheets, reducing thermal resistance
Data Source
AI summary
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.