LTPO Display Panel Interconnect Layout for Reliable TFT Connections

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Solution Overview

Problem

The manufacturing processes for low temperature polycrystalline oxide (LTPO) display panels are complicated due to the connections of different TFTs, which affect the performance and reliability of the display panels.

Innovation Solution

A display panel structure and manufacturing method involving a base substrate with specific layers and through holes, where metal portions are electrically connected to active layers to prevent damage during subsequent processing steps, ensuring normal electrical connections and improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If different TFTs are connected in LTPO technology, then fast response time and lower power consumption are achieved, but manufacturing processes become difficult

Engineering Contradiction:
Improvedisplay performanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the TFT structure into distinct segments: a first TFT with a first active layer and a second TFT with a second active layer. These segmented TFTs are connected through a metal layer that selectively contacts different regions. This segmentation allows independent optimization of each TFT while simplifying the overall manufacturing process by reducing the need for complex interconnections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The metal layer serves as an intermediary element that connects the first and second TFTs. It selectively contacts the first active layer and the second active layer through defined pathways, enabling electrical connection between different TFTs while maintaining manufacturing simplicity. The metal layer acts as a mediator that resolves the complexity of direct TFT-to-TFT connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If multiple through holes and metal portions are added to connect TFTs, then electrical connections are improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidthrough hole alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The metal layer is formed in advance during the manufacturing process, before the through holes are etched. The metal layer is deposited and patterned to define the connection pathways. Subsequently, through holes are etched through the insulating layers to expose specific regions of the active layers. This preliminary formation of the metal layer establishes a reference structure that guides subsequent etching steps, reducing alignment precision requirements.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The metal layer exhibits local quality by having different contact configurations in different regions. In the first region, it contacts the first active layer; in the second region, it contacts the second active layer. This localized differentiation allows selective electrical connections without requiring high-precision alignment across the entire structure, as each region can be optimized independently.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11923380B2Display panel with LTPO TFT having top-gate oxide TFT and manufacturing method thereof
Publication Date: 2024.03.05 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US11923380B2 patent drawing
  • US11923380B2 patent drawing
  • US11923380B2 patent drawing

AI summary

A display panel and a manufacturing method thereof are provided. The display panel includes a base substrate, a first active layer, a first gate insulating layer, a first gate layer, and a second gate insulating layer stacked in sequence on the base substrate, and a metal layer, a first interlayer dielectric layer, a first source, and a first drain. A first metal portion and a second metal portion of the metal layer are respectively filled in a first through hole and a second through hole of the second gate insulating layer and are electrically connected to the first active layer.