Luminous Device Conductive Substrate Grooves Thermal Management
Solution Overview
Problem
Current luminous devices, such as LEDs and semiconductor lasers, face challenges in efficiently directing light emission and thermal management, with existing technologies not effectively addressing the need for controlled light directionality and heat dissipation.
Innovation Solution
The development of luminous devices with a conductive substrate that includes a patterned insulation layer and electrodes, allowing for the formation of grooves and convex structures to enhance light emission directionality and thermal conductivity, along with the integration of a zener diode for electrical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional luminous device structure is used, then the device can emit light, but the light emission directionality is poor and thermal management is inefficient
Solution Approach 1:
The device is divided into distinct functional regions: a light-emitting region with specific directional emission characteristics and a separate heat dissipation region with high thermal conductivity materials. This segmentation allows independent optimization of light directionality and thermal management, resolving the contradiction between these two parameters.
Solution Approach 2:
Different regions of the device are assigned different material properties: the light-emitting region uses materials optimized for directional light emission, while the heat dissipation region uses materials with high thermal conductivity. This local differentiation enables simultaneous improvement of light emission directionality and thermal management efficiency.
2Ease of manufacture
If the device structure is simplified, then the manufacturing process is easier, but the device cannot effectively control light direction or dissipate heat
Solution Approach 1:
Certain structural components are designed to serve multiple functions: the reflective layer both directs light emission and provides a boundary for heat dissipation, while the substrate structure simultaneously supports mechanical integrity and facilitates thermal conduction. This multi-functionality maintains manufacturing simplicity while achieving reliable light direction control and heat dissipation.
3Device complexity
If no electrical protection is integrated, then the device structure is simpler, but the device is vulnerable to reverse bias voltage damage
Solution Approach 1:
A protection diode is integrated into the device structure during the manufacturing process, positioned to provide immediate protection against reverse bias voltage before damage can occur. This preliminary protective measure is built into the device architecture, preventing future failures without requiring complex external protection circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves light emission efficiency by controlling light directionality and increasing thermal conductivity, while also protecting the device from reverse bias voltage surges, enhancing overall performance and reliability.
Implementation Method 1
thermally conducting heat away from the luminous device
Implementation Method 2
increasing the emission of reflected light
Implementation Method 3
integration of a zener diode for electrical protection
Data Source
AI summary
The present invention is directed to a vertical-type luminous device and high throughput methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems. The luminous devices are designed to maximize light emitting efficiency and/or thermal dissipation. Other improvements include an embedded zener diode to protect against harmful reverse bias voltages.