Macrocell Support Structures for Epitaxial Heat Exchange
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Solution Overview
Problem
Semiconductor processing chambers face challenges with temperature uniformity, leading to reduced product yield due to non-uniform temperatures and inefficient heat dissipation, which causes thermal degradation and increased maintenance needs.
Innovation Solution
The implementation of a macrocell support structure with interconnecting physical supports that define fluidly-connected pores, allowing for improved heat transfer and radiative shielding, using materials like metal, ceramic, or polymer to absorb and redirect electromagnetic energy, enhancing energy management and process effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional solid support structures are used in epitaxial growth processing chambers, then structural strength is maintained, but temperature uniformity deteriorates due to inefficient heat dissipation and thermal degradation
Solution Approach 1:
The patent applies porous macrocell support structures with interconnected pores filled with heat transfer fluid to improve thermal management. The porous architecture increases surface area for heat exchange while maintaining structural integrity, enabling more uniform temperature distribution across the substrate during epitaxial growth processing, thereby resolving the contradiction between temperature uniformity and product yield
Solution Approach 2:
The patent integrates heat transfer fluid circulation systems through the porous support structures, using fluid flow to actively manage heat dissipation. The fluid circulated through the interconnected pores absorbs and redistributes thermal energy, improving temperature uniformity and preventing thermal degradation that would otherwise reduce product yield
2Duration of action of stationary object
If conventional heat management components are used, then device simplicity is maintained, but thermal stress increases leading to reduced component lifespan
Solution Approach 1:
The porous macrocell support structures provide enhanced heat dissipation pathways that reduce thermal gradients and associated thermal stress on components. The interconnected pore network allows efficient heat transfer throughout the structure, preventing localized overheating and thermal shock, thereby extending component operational lifespan
Solution Approach 2:
The patent employs composite structures combining porous support materials with heat transfer fluids, creating a hybrid thermal management system. This composite approach integrates structural support functions with active heat dissipation, reducing thermal stress on individual components and extending their operational life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved temperature control, reduces thermal stress, and increases the operational lifespan of components by efficiently managing heat transfer and energy distribution within the epitaxial growth processing chamber.
Implementation Method 1
improved heat transfer and radiative shielding, using materials like metal, ceramic, or polymer to absorb and redirect electromagnetic energy
Implementation Method 2
inlet fluid flow port that is configured to provide fluid communication between the macrocell support structure and an exterior of the epitaxial growth processing chamber
Data Source
AI summary
An epitaxial growth processing chamber with a component having a macrocell support structure configured with interconnecting physical supports that define fluidly-connected pores is described. A component configured for use in an epitaxial growth processing chamber having a macrocell support structure configured with interconnecting physical supports that define fluidly-connected pores is also described. The component is a baseplate, an exhaust cap, an injection ring, an injection cap, a lower reflector, an upper reflector, a lower heat shield, an upper heat shield, a cone reflector, or combinations thereof. In some instances, the component may further include an inlet flow port. In some other instances, the component may further include an inlet flow port, outlet flow port and a fluid flow wall, and optionally a fluid flow baffle, and optionally a reflective surface.