Magnet Head Transfer for Fast, Low-Damage Micro-LED Chip Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current micro-LED display manufacturing processes face challenges in rapidly and accurately transferring large amounts of LED chips, which can lead to damage and reduced lifespan of equipment.
Innovation Solution
A micro-LED display manufacturing apparatus featuring a chip tray, a chip bath, a magnet head with a magnet housing and elevating member, and a head transfer device that minimizes transfer distance and damage by using magnetic forces and a glass surface for adsorption and separation of LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transfer method is used for LED chips, then the transfer distance is long, but this increases the risk of damage and reduces transfer speed
Solution Approach 1:
The magnet housing is nested within the head housing, and the elevating member is nested within the magnet housing. This nested structure compactly integrates multiple functional components, enabling the magnet head to achieve both rapid movement and precise chip handling within a compact form factor, thereby improving transfer speed while maintaining reliability
Solution Approach 2:
A glass surface is introduced as an intermediary between the magnet and the LED chip. The glass surface adsorbs the LED chip during transfer, providing a protective interface that reduces direct contact and potential damage to the chip while enabling controlled manipulation, thus improving both transfer speed and reducing damage risk
2Productivity
If frequent transfer operations are performed, then productivity increases, but the lifespan of the apparatus decreases
Solution Approach 1:
The glass surface acts as a cushioning layer between the magnet and the LED chip. This protective interface absorbs mechanical stresses during transfer operations, preventing direct impact and wear on the chip and apparatus components, thereby enabling frequent operations while preserving apparatus lifespan
Solution Approach 2:
Magnetic force is used to replace direct mechanical contact for chip manipulation. The magnet head uses magnetic fields to adsorb and move chips without physical gripping or clamping, significantly reducing mechanical wear and stress on both the chips and the apparatus, thus improving transfer efficiency while extending apparatus lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and reliable transfer of LED chips with reduced risk of damage, extending the lifespan of the apparatus and improving the efficiency of the micro-LED display manufacturing process.
Implementation Method 1
a magnet head configured to adsorb/separate the LED chip by magnetic force
Data Source
AI summary
The present embodiment comprises: a chip tray accommodated in a chamber; a chip bath in which a plurality of LED chips are accommodated; a magnet head which adsorbs/isolates an LED chip by a magnetic force; and a head transport mechanism which transports the magnet head to a first position of the chip bath and a second position of the chip tray, wherein the magnet head comprises: a magnet housing in which a magnet is accommodated; a moving-up/down member which moves up and down the magnet housing; a driving source which moves up and down the moving-up/down member; and a glass to/from which an LED chip is adsorbed or isolated.