Magnetic Alignment Module for LED Die Transfer
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Solution Overview
Problem
Conventional die transfer technologies, such as SMT and wafer-to-wafer transfer, face limitations in mass transfer efficiency, accuracy, and cost due to strict substrate size requirements and potential damage to die structures, making them inadequate for rapid and accurate mass transfer of magnetic light-emitting diodes.
Innovation Solution
An alignment module and method utilizing a magnetic metallic substrate with soft magnetic properties and a magnetic pull device to magnetically attract and align magnetic light-emitting diodes onto a backplane with cavities, reducing the need for precise substrate matching and minimizing soldering material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional surface mount technology is used for die transfer, then single die placement is achieved, but mass transfer efficiency is poor
Solution Approach 1:
The patent combines multiple die transfer operations into a single unified process by integrating the magnetic pull device with the backplane structure. The magnetic field simultaneously attracts and positions multiple dies onto the backplane in one operation, eliminating the need for sequential single-die placement and significantly improving mass transfer efficiency
Solution Approach 2:
The patent replaces conventional mechanical transfer mechanisms (such as vacuum nozzles and mechanical pick-and-place systems) with a magnetic field-based system. The magnetic pull device generates a magnetic field that acts on the magnetic metallic substrate of each die, enabling contactless attraction and positioning, thereby simplifying the transfer process and improving productivity
2Manufacturing precision
If wafer-to-wafer transfer technology is used, then die transfer is achieved, but strict substrate size matching is required
Solution Approach 1:
The patent employs self-alignment mechanisms where the magnetic pull device and cavity structure work together to automatically position the die. The magnetic field attracts the die toward the cavity, and the cavity geometry guides the die into the correct position, eliminating the need for precise pre-matching of substrate sizes and enabling greater flexibility in substrate design
Solution Approach 2:
The cavity in the backplane serves as an intermediary structure that mediates between the die and the final mounting position. The cavity provides a physical guide and reference that facilitates accurate alignment without requiring strict matching between the original substrate and target substrate, thereby improving adaptability while maintaining precision
3Productivity
If electrostatic transfer technology is used, then die transfer is achieved, but die structure damage is likely
Solution Approach 1:
The patent replaces electrostatic transfer mechanisms with a magnetic field-based system. The magnetic pull device generates a magnetic field that acts on the magnetic metallic substrate, providing a more controlled and gentler attraction force that reduces the risk of die structure damage while maintaining high transfer speed and reliability
4Manufacturing precision
If conventional die transfer alignment is used, then die placement is achieved, but alignment accuracy is insufficient
Solution Approach 1:
The patent incorporates preliminary alignment features in the cavity structure and magnetic pull device configuration before the transfer process begins. The cavity geometry and magnetic field distribution are pre-designed to guide the die into the correct position during attraction, enabling accurate alignment to be achieved automatically without requiring time-consuming manual adjustment or complex post-alignment procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate mass transfer of magnetic light-emitting diodes with reduced process time and cost, while ensuring precise alignment and minimizing soldering material consumption.
Implementation Method 1
a magnetic pull device... to magnetically attract and align magnetic light-emitting diodes onto a backplane with cavities
Data Source
AI summary
An alignment module and alignment method for transferring magnetic light-emitting die are provided, including a backplane having at least one cavity, a magnetic pull device and magnetic light-emitting die. The magnetic pull device is located below the cavity and disposed correspondingly to the cavity. The magnetic light-emitting die includes a magnetic metallic substrate and a peripheral electrode formed on the magnetic metallic substrate. The peripheral electrode is surrounding on the magnetic metallic substrate and formed adjacent to an inner edge of the magnetic metallic substrate. Depth of the cavity is designed as equal to a thickness of the magnetic metallic substrate such that the die is accommodated and aligning transferred to the backplane by using the cavity and magnetic pull device. By employing the proposed die alignment techniques, accurate alignment result is achieved and thereby the present invention is applied perfectly for industrial mass transfer technology.