Magnetic Composite Inductor for High-Density PCB Integration
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Solution Overview
Problem
There is a need to enhance the capacitance and inductance of inductors in semiconductor chips while simultaneously reducing their size and increasing integration density in printed circuit boards.
Innovation Solution
A printed circuit board design that incorporates a magnetic structure with a through-hole filled by an insulating film and a conductor layer, forming a magnetic composite inductor (MCI), which includes a magnetic layer, insulating film, conductor layer, and wiring and via layers, allowing for improved capacitance and inductance with a more compact and integrated design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inductor is designed with improved inductance by changing material and structure, then inductance is improved, but device size increases and integration density decreases
Solution Approach 1:
The patent combines the inductor and capacitor into a single integrated structure where the magnetic layer serves dual purposes: providing magnetic flux for inductance enhancement and acting as the capacitor dielectric. The conductor layers form both the inductor windings and capacitor electrodes, merging two separate components into one unified device that achieves both inductance improvement and size reduction.
Solution Approach 2:
The patent employs composite material structure by stacking multiple magnetic layers with different magnetic permeabilities to create a composite magnetic core. This composite approach allows optimization of inductance characteristics while maintaining compact dimensions, as different materials contribute different magnetic properties that collectively enhance the overall inductor performance without proportionally increasing size.
2Use of energy by moving object
If various passive devices are embedded in a package substrate, then power efficiency and chip slimness are improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the inductor and capacitor manufacturing processes into a single integrated fabrication sequence. Both components are formed simultaneously using the same magnetic layer deposition, conductor layer patterning, and via formation steps, eliminating the need for separate manufacturing processes and reducing overall manufacturing complexity despite the advanced functionality.
Solution Approach 2:
The magnetic layer serves multiple functions: it provides magnetic flux for inductance, acts as the capacitor dielectric, and serves as a structural support layer. The conductor layers simultaneously form inductor windings and capacitor electrodes. This multi-functionality reduces the number of separate manufacturing steps required compared to embedding discrete passive devices.
3Reliability
If a through-hole is filled with insulating film and conductor layer to form magnetic structure, then capacitance and inductance are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary plating to the inner walls of through-holes before filling them with conductor material. This preliminary action creates a nucleation layer that ensures uniform conductor deposition and prevents void formation, thereby reducing manufacturing precision requirements for the subsequent filling process while ensuring reliable electrical connections and consistent electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances capacitance and inductance of inductors, enabling a more slimmed-down and highly integrated printed circuit board with minimized current paths and simplified manufacturing processes.
Implementation Method 1
a magnetic structure including a magnetic layer having a through-hole... directly form a magnetic composite inductor (MCI)
Data Source
AI summary
A printed circuit board includes a magnetic structure including a magnetic layer having a through-hole, an insulating film disposed on a wall surface of the through-hole, the insulating film including an inorganic insulating material, and a conductor layer disposed on the insulating film, the conductor layer filling at least a portion of the through-hole, the conductor layer including a metal, an insulating layer covering at least a portion of the magnetic structure, a wiring layer disposed on or in the insulating layer, and a via layer disposed in the insulating layer, the via layer including a first connection via connecting the conductor layer to the wiring layer.