Magnetic Device Heat Dissipation Structure for Uniform Core Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing heat flux density on circuit boards due to compact layouts of power devices in electronic devices, particularly in magnetic devices like inductors and transformers, leads to significant temperature differences and poor heat dissipation, limiting their application scenarios and device performance.
Innovation Solution
A heat dissipation structure is introduced with a thermally conductive film on the magnetic core and a thermally conductive medium between the magnetic device and a heat sink, enhancing temperature uniformity and efficiency by conducting heat generated by the magnetic device to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulation film is added to the copper wire, then insulation of the copper wire is improved, but the overall thickness of the copper wire increases, making the heat dissipation path from the magnetic core to the heat sink longer
Solution Approach 1:
A thermally conductive film is introduced as an intermediary layer between the magnetic core and the heat sink. This film has high thermal conductivity to facilitate heat transfer, while being thin enough not to significantly increase the overall heat dissipation path length. The film acts as a mediator that improves thermal contact without compromising the insulation provided by the copper wire's insulation film.
2Stability of the object's composition
If the copper wire is wrapped around the magnetic core, then the magnetic device structure is formed, but the heat dissipation path becomes long and temperature difference between inner and outer layers increases
Solution Approach 1:
The patent applies thermally conductive grease not only at the bottom interface but also on the side surfaces of the magnetic core. This multi-dimensional approach to heat dissipation creates additional heat transfer pathways, reducing the temperature difference between the inner and outer layers of the wrapped copper wire structure.
3Ease of manufacture
If magnetic devices are used with low thermal conductivity material, then the magnetic device can be manufactured, but heat generated at the magnetic core cannot spread outward effectively
Solution Approach 1:
The patent combines the magnetic core material (with inherently low thermal conductivity) with thermally conductive materials (grease and film) to create a composite heat dissipation system. This composite approach allows the magnetic device to maintain its manufacturing simplicity while significantly improving heat dissipation efficiency through the high thermal conductivity of the added materials.
4Productivity
If compact layout of power devices is used, then device integration is improved, but heat flux density on the circuit board increases
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional bottom-only approach and adds it to the side surfaces of the magnetic core as well. By providing multiple heat dissipation pathways (bottom and sides), the system can handle higher heat flux densities enabled by compact layouts without compromising thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure improves temperature uniformity and heat dissipation efficiency, reducing the risk of over-temperature and enhancing the performance and competitiveness of electronic devices.
Implementation Method 1
a thermally conductive film may be disposed on at least a part of a side surface of the stopper... heat generated by the magnetic device may be conducted to the thermally conductive medium
Implementation Method 2
the thermally conductive medium is in thermal contact with the heat sink and at least a part of the magnetic device... heat generated by the magnetic device may be conducted to the thermally conductive medium, and then transferred to the heat sink for heat dissipation
Implementation Method 3
a heat sink, and a thermally conductive medium... transferred to the heat sink for heat dissipation
Data Source
Figure 1~3
Figure 4~6
Figure 7~9
AI summary
This application provides a heat dissipation structure and an electronic device. The heat dissipation structure may include a circuit board, a magnetic device, a heat sink, and a thermally conductive medium, and the magnetic device may be located between the circuit board and the heat sink. The magnetic device may include a magnetic core and a film-wrapped cable, the magnetic core includes a stopper and a central magnetic cylinder that are fastened together, the film-wrapped cable is wound around the central magnetic cylinder, and the film-wrapped cable is electrically connected to the circuit board. In the heat dissipation structure, a thermally conductive film may be disposed on at least a part of a side surface of the stopper. In this way, temperature uniformity of the magnetic device can be effectively improved, so that a problem of a local high temperature of the magnetic device is resolved. In addition, the thermally conductive medium may be disposed between the magnetic device and the heat sink, and the thermally conductive medium is in thermal contact with the heat sink and at least a part of the magnetic device. In this case, heat generated by the magnetic device may be conducted to the thermally conductive medium and then transferred to the heat sink for heat dissipation. This can effectively improve heat dissipation efficiency of the heat dissipation structure, so that performance of an electronic device in which the heat dissipation structure is disposed is improved.