Magnetic Microcomponent Handling via Electromagnetic Collection Head
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Solution Overview
Problem
Current methods for handling microcomponents in fluidic assembly lack efficient techniques for selective positioning, transfer, and management, particularly for high-value, dense, and fragile components, due to the lack of effective external force application during singulation, assembly, cleaning, testing, and bonding processes.
Innovation Solution
The implementation of magnetic dipoles on microcomponents allows for controlled non-contact force manipulation, enabling magnetic handling and management through electromagnetic collection and distribution heads, which can selectively capture, transfer, and position microcomponents without damaging them, and facilitate cleaning and recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mechanical handling methods are used for microcomponents, then the handling process is simple, but the microcomponents suffer damage and positioning precision deteriorates
Solution Approach 1:
The patent replaces conventional mechanical handling systems with a magnetic field-based handling system. Electromagnetic actuators generate magnetic fields that interact with magnetically susceptible microcomponents, enabling contactless manipulation. This substitution eliminates mechanical contact that causes damage while providing precise positioning control through field modulation, thus improving reliability without requiring complex mechanical structures.
Solution Approach 2:
The patent introduces magnetic fields as an intermediary between the handling system and microcomponents. The electromagnetic actuators create magnetic fields that serve as a mediator to transmit force and positioning information to the microcomponents without direct mechanical contact. This intermediary approach allows for gentle, damage-free handling while maintaining precise control over component placement.
2Manufacturing precision
If magnetic fields are applied for microcomponent handling, then positioning precision is improved, but the complexity of the handling system increases
Solution Approach 1:
The patent designs electromagnetic actuators that serve multiple functions: generating magnetic fields for contactless handling, providing precise positioning control, and enabling orientation control of anisotropic microcomponents. This multi-functionality reduces the need for separate mechanical positioning and orientation mechanisms, thereby improving precision while limiting the increase in overall system complexity.
Solution Approach 2:
The patent utilizes the ability to dynamically adjust magnetic field parameters (strength, direction, distribution) to achieve precise positioning and orientation of microcomponents. By changing field parameters rather than adjusting mechanical components, the system achieves high manufacturing precision through software-controlled field modulation, reducing the need for complex mechanical adjustment mechanisms.
3Reliability
If contactless magnetic handling is used, then microcomponent damage is reduced, but the ability to apply selective external forces decreases
Solution Approach 1:
The patent implements spatially selective magnetic field generation through arrays of electromagnetic actuators positioned around the processing chamber. Each actuator can generate localized magnetic fields that act on specific microcomponents or regions, enabling selective force application. This local field generation capability maintains contactless handling for integrity while providing versatile, targeted force application for different handling operations.
Solution Approach 2:
The patent employs dynamically controllable electromagnetic actuators that can rapidly adjust magnetic field characteristics in response to different handling requirements. The system transitions between different magnetic field configurations to perform various operations (pickup, positioning, orientation, release) without mechanical contact, thereby maintaining microcomponent integrity while achieving versatile force application through temporal and spatial field modulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the handling and utilization of microcomponents throughout the assembly process by providing precise control over their positioning and orientation, improving yield and reducing defects, while allowing for efficient recycling and reuse of microcomponents.
Implementation Method 1
suspending a plurality of magnetically polarized microcomponents in the first solution
Implementation Method 2
A magnetic dipole on microcomponents used in fluidic assembly
Implementation Method 3
A magnetic field is induced in the collection head and the microcomponents are exposed to the magnetic field. A plurality of microcomponents becomes fixed in position on a collection surface in response to the magnetic field
Data Source
AI summary
Fluid-suspended microcomponent management systems and methods are provided. The method provides a first reservoir containing a first solution and a magnetic collection head. A plurality of magnetically polarized microcomponents is suspended in the first solution, where each microcomponent has a maximum cross-section of 150 micrometers (μm) and a maximum mass of 1 microgram. A magnetic field is induced in the collection head and the microcomponents are exposed to the magnetic field. A plurality of microcomponents becomes fixed in position on a collection surface in response to the magnetic field. In one aspect, the step of exposing the microcomponents to the magnetic field includes immersing the collection head in the first reservoir. As a result, the plurality of microcomponents is collected on a surface of the collection head. Alternatively, the step of fixing the plurality of microcomponents in position includes fixing the microcomponents in position on the collection surface sidewall.