Magnetic Micro LED Structure for Flip-Chip-Free Mass Transfer
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Solution Overview
Problem
The existing LED technologies face challenges with high manufacturing costs and complex processes, particularly in mass transfer of Micro LEDs, due to poor thermal expansion coefficients and the need for flip-chip technology, which increases operational time and manpower costs.
Innovation Solution
A magnetic light-emitting structure and fabrication method utilizing a magnetic metal composite substrate with soft magnetic properties and initial magnetic permeability, enabling automatic reversal of crystal dies and eliminating the need for flip-chip processes through a substrate with a nickel-iron alloy and copper layers, combined using cutting and etching processes for efficient mass transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mass transfer technology is used for Micro LEDs, then individual Micro LED chips can be transferred, but the manufacturing cost and operational time increase significantly
Solution Approach 1:
The substrate is divided into multiple individual Micro LED chips that can be processed simultaneously. The magnetic metal composite substrate allows for batch processing of multiple chips in parallel, eliminating the need for sequential individual chip handling and significantly improving mass transfer efficiency.
Solution Approach 2:
The magnetic metal composite substrate with vertical structure enables automatic alignment and positioning of Micro LED chips through magnetic properties. The substrate itself provides the alignment function that would otherwise require external manipulation equipment, reducing operational time and complexity.
2Reliability
If flip-chip technology is used for Micro LED assembly, then connection points are established, but the process complexity and manpower costs increase
Solution Approach 1:
Instead of flipping the chip to establish connections (traditional flip-chip method), the invention inverts the approach by maintaining the vertical structure of the magnetic metal composite substrate and achieving connections through the vertical electrode configuration. This eliminates the complex flipping operation while maintaining reliable electrical connections.
Solution Approach 2:
The invention extracts the essential function of connection establishment from the complex flip-chip process. By using the vertical electrode structure of the magnetic metal composite substrate, the connection function is achieved through a simpler process that removes the unnecessary flipping step, reducing overall process complexity.
3Stability of the object's composition
If substrates with poor thermal expansion coefficient are used, then thermal stability is reduced, but the substrate bends and deforms under temperature changes
Solution Approach 1:
The invention uses a magnetic metal composite substrate consisting of multiple layers with different materials (magnetic metal layer, non-magnetic metal layer, and insulating layer). This composite structure combines materials with complementary properties to achieve both thermal stability and resistance to deformation under temperature changes.
Solution Approach 2:
The invention changes the thermal parameters of the substrate by selecting materials with specific thermal expansion coefficients for each layer. The magnetic metal layer and non-magnetic metal layer are chosen with appropriate thermal properties to compensate for each other, maintaining overall dimensional stability during temperature variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time by enabling automatic alignment and positioning of Micro LEDs, improving thermal conductivity and stability, and facilitating rapid mass transfer while maintaining high thermal conductivity and low thermal expansion coefficients.
Implementation Method 1
A magnetic light-emitting structure and fabrication method utilizing a magnetic metal composite substrate with soft magnetic properties and initial magnetic permeability, enabling automatic reversal of crystal dies
Implementation Method 2
combined using cutting and etching processes for efficient mass transfer
Data Source
AI summary
A magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element are provided. The fabrication method comprises providing a magnetic metal composite substrate, wherein a second metal layer is respectively disposed on an upper and lower surface of a first metal layer; forming a connecting metal layer, an epitaxial layer and a plurality of electrode unit on top; and performing a complex process, which removes the second metal layer on the lower surface of the first metal layer and part of the first metal layer and performs cutting according to the number of the electrode unit, so as to form a plurality of epitaxial die. Each epitaxial die corresponds to an electrode unit to form a magnetic light-emitting element. The proposed method improves soft magnetic properties of an original substrate and enables dies to reverse spontaneously, thereby used perfectly for industrial mass transfer technology.