Magnetic Particle Embedded Flexible Substrate for Carrier Plate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional manufacturing techniques for rigid electronics are inadequate for handling flexible and stretchable substrates, leading to issues such as shape maintenance, ripping, tearing, and adhesion residue, which increase costs and complexity.
Innovation Solution
Implementing a magnetic particle embedded flexible substrate or a printed flexible substrate with a magnetic tray or electromagnetic carrier, utilizing magnetic attraction to hold the substrate flat during manufacturing processes, eliminating the need for mechanical clamps and adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mechanical clips, clamps, and presses are used to hold flexible substrates during manufacturing, then the substrate can be secured to the carrier, but the flexible substrates are damaged (ripping, tearing, or deforming) due to the fragile nature of the materials
Solution Approach 1:
The patent replaces mechanical holding systems (clips, clamps, presses) with a magnetic field-based holding system. The magnetic carrier generates a magnetic field that attracts and holds the flexible substrate without mechanical contact, eliminating the damage caused by mechanical force while maintaining secure positioning during manufacturing processes
Solution Approach 2:
The patent changes the physical parameter of the holding force from mechanical contact force to magnetic field attraction. By utilizing magnetic field strength as the holding parameter, the system can apply sufficient force to secure the substrate without the localized high stress points that cause ripping and tearing in mechanical systems
2Reliability
If adhesive tape is used to secure flexible substrates to carrier plates, then the substrate can be held in place, but adhesive residue is left on the substrate and carrier plate requiring additional cleaning steps
Solution Approach 1:
The patent substitutes adhesive-based mechanical bonding with magnetic field attraction. This eliminates the need for adhesive application and removal processes, reducing process complexity while maintaining reliable substrate positioning through controllable magnetic forces
Solution Approach 2:
The magnetic carrier can be reused indefinitely without the degradation and contamination issues associated with adhesive tape. The magnetic field generation capability remains consistent across multiple uses, eliminating the waste and cleaning requirements associated with single-use or reusable adhesive tapes
3Ease of manufacture
If flexible substrates are placed on carrier plates without mechanical or adhesive securing, then the substrate material is protected from damage, but the flexible substrates fail to maintain their shape and are blown off by air currents
Solution Approach 1:
The patent uses magnetic field attraction to provide stable shape maintenance without mechanical contact. The magnetic force distributes evenly across the substrate surface, preventing warping and curling while resisting air currents, unlike passive placement which offers no stabilization
Solution Approach 2:
The magnetic attraction force acts as a counterbalancing force against the destabilizing effects of air currents and substrate flexibility. This magnetic 'anti-force' maintains shape stability without requiring mechanical constraints that would cause damage
4Productivity
If conventional manufacturing techniques for rigid substrates are applied to flexible substrates, then existing manufacturing processes can be used, but the processes cause damage including ripping, tearing, and warping due to the fragile nature of flexible materials
Solution Approach 1:
The patent replaces the mechanical handling system used for rigid substrates with a magnetic field-based system optimized for flexible materials. This allows continuous manufacturing processes to be applied to flexible substrates without the ripping, tearing, and warping caused by mechanical clamps and presses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the manufacturability of flexible substrates by preventing warping, curling, and detachment, allowing for seamless integration into wearable devices without additional processing steps or waste, while maintaining the flexibility and elasticity of the materials.
Implementation Method 1
the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate
Data Source
AI summary
In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.