Magnetic Shielding Semiconductor Chip U-Shaped Substrate
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Solution Overview
Problem
Existing semiconductor devices face noise generation and reliability issues due to external magnetic fields, and current manufacturing methods struggle with effective sealing and magnetic shielding, leading to voids and reduced reliability in bonding between the semiconductor chip and the substrate.
Innovation Solution
A semiconductor device manufacturing method involving a U-shaped magnetic substrate with side wall portions and a plate-like magnetic substrate, both made of high magnetic permeability materials, is used to surround and protect the semiconductor chip, with a sealing film applied to ensure secure contact and sealing without voids, enhancing magnetic shielding and reducing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If two magnetic substrates are arranged to extend around the semiconductor chip for magnetic shielding, then magnetic shielding effectiveness is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The magnetic shielding structure is divided into two separate magnetic substrates: a first magnetic substrate with side wall portions that contacts the semiconductor chip, and a second magnetic substrate with a resin layer that is positioned separately. This segmentation allows each substrate to be manufactured and positioned independently, reducing overall manufacturing complexity while maintaining effective magnetic shielding around the chip.
Solution Approach 2:
A resin layer is introduced as an intermediary between the second magnetic substrate and the semiconductor chip. This resin layer facilitates proper positioning and contact of the magnetic substrates with the chip, simplifying the assembly process and reducing manufacturing difficulty while ensuring effective magnetic shielding coverage.
2Reliability
If magnetic substrates are positioned to contact the semiconductor chip for sealing, then sealing effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The first magnetic substrate is pre-formed with side wall portions that are designed to contact specific surfaces of the semiconductor chip. This preliminary structuring of the magnetic substrate creates built-in positioning features that guide correct placement, reducing the precision requirements during the actual assembly process while ensuring reliable sealing contact.
Solution Approach 2:
The resin layer serves as a positioning intermediary between the second magnetic substrate and the semiconductor chip. It provides a compliant interface that accommodates minor positioning variations and ensures uniform contact pressure, thereby maintaining sealing effectiveness without requiring extremely high manufacturing precision.
3Reliability
If additional resin is applied for sealing between magnetic substrates, then sealing completeness is improved, but device size increases
Solution Approach 1:
The resin layer is merged with the second magnetic substrate, forming an integrated component rather than a separate additive element. This integration allows the resin to serve dual purposes: providing sealing between the magnetic substrates and acting as a positioning intermediary, thereby achieving complete bonding reliability without increasing overall device volume.
Solution Approach 2:
A thin resin layer is used instead of thick sealing material. This thin film provides sufficient sealing and bonding reliability between the magnetic substrates while occupying minimal space, thus preventing increase in device size while maintaining complete sealing effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively seals the semiconductor chip, reduces the risk of voids, enhances magnetic shielding, and minimizes device size by eliminating the need for additional resin application, resulting in improved reliability and stability of the semiconductor device.
Implementation Method 1
two magnetic substrates having high magnetic permeability are prepared and arranged so as to extend around the semiconductor chip
Data Source
AI summary
A method of manufacturing a semiconductor device includes: providing, on a substrate, a first magnetic substrate including a base, a first side wall portion and a second side wall portion at opposed ends of the base, the sidewall portions extending from the base, providing a semiconductor chip over the base at a location between the first side wall portion and the second side wall portion, providing a plate-like magnetic substrate having a second surface, the second surface provided with a resin thereon, and positioning the plate-like magnetic substrate having a second surface with the resin thereon such that the second surface faces the base of the first magnetic substrate. Then the plate like magnetic substrate is moved in the direction of the first magnetic substrate to contact the second surface of the plate like magnetic substrate with the first side wall portion and the second side wall portion.