Magnetic Transfer Substrate for Complete LED Microtransfer
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Solution Overview
Problem
Current methods for assembling large and high-resolution display devices with light emitting diodes (LEDs) face challenges in accurately transferring a large number of LEDs to a wiring board, often resulting in incomplete transfers due to insufficient adhesion and mechanical damage to the mold, leading to increased manufacturing costs and inefficiencies.
Innovation Solution
A transfer substrate with a base substrate, a magnetic or conductive plate, and a mold with grooves and openings, utilizing magnetic or electrical forces to detach and reattach components, ensuring precise transfer of light emitting devices to a substrate without leaving any behind, thereby enhancing adhesion and reducing the need for separate repair processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods are used to assemble light emitting devices, then the manufacturing process can be completed, but incomplete transfers occur due to insufficient adhesion and mechanical damage to the mold
Solution Approach 1:
The transfer substrate is divided into multiple molds, each containing multiple cavities that can independently hold and transfer light emitting devices. This segmentation allows for controlled transfer of individual devices or groups of devices, improving transfer completeness while reducing the need for complete mold replacement in case of damage.
Solution Approach 2:
A magnetic body is introduced as an intermediary element between the mold and the light emitting devices. The magnetic body interacts with the devices through magnetic attraction to enhance adhesion during transfer, preventing incomplete transfers without requiring direct modification of the mold structure.
2Productivity
If conventional transfer methods are used, then assembly can proceed, but mechanical damage to the mold occurs leading to increased manufacturing costs
Solution Approach 1:
The magnetic body serves as a mediator that applies magnetic force to hold and transfer the light emitting devices, eliminating the need for mechanical clamping or pressing that would damage the mold. This maintains assembly efficiency while protecting mold integrity.
Solution Approach 2:
The patent replaces mechanical adhesion methods (such as vacuum suction or mechanical pressing) with magnetic field-based adhesion. The magnetic body generates magnetic force to securely hold the light emitting devices during transfer, reducing mechanical stress on the mold and extending its service life.
3Reliability
If magnetic or electrical forces are used to enhance adhesion, then transfer completeness improves, but the device complexity increases
Solution Approach 1:
The magnetic body is positioned locally within each mold cavity rather than requiring a complex overall system redesign. Each cavity can have its own magnetic body or share a common magnetic structure, allowing for modular implementation that minimizes overall device complexity while improving transfer completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution ensures efficient and complete transfer of light emitting devices, reducing manufacturing costs and improving the reliability of the transfer process by using magnetic or electrical forces to securely attach the devices to the substrate, minimizing the risk of incomplete transfers and mechanical damage.
Implementation Method 1
a magnetic plate disposed on a surface of the base substrate, a mold disposed on another surface of the base substrate and including a plurality of grooves, and a magnetic body disposed in the plurality of grooves of the mold
Implementation Method 2
a conductive plate disposed on a side of the base substrate, a mold disposed on another side of the base substrate and including a plurality of grooves, and a conductive pattern disposed in the plurality of grooves of the mold
Data Source
AI summary
A transfer substrate according to an embodiment includes a base substrate, a magnetic plate disposed on a surface of the base substrate, a mold disposed on another surface of the base substrate and including a plurality of grooves, and a magnetic body disposed in the plurality of grooves of the mold.