Magnetic Vacuum Substrate Holder for Leakage Prevention
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Solution Overview
Problem
Current substrate handling and locking systems for chemical and/or electrolytic surface treatment in the semiconductor industry face challenges in efficiently and safely securing substrates during processing, particularly with increased manufacturing tolerances and misalignment, which can lead to leakage and uneven material deposition.
Innovation Solution
A substrate holding and locking system that combines a magnetic locking unit with a reduced pressure holding unit, utilizing a pump to control interior pressure below atmospheric pressure, ensuring secure substrate retention without external screws, and allowing for easy automation, flexibility in single or dual side treatment, and stability during surface treatment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate holding and locking system is used for chemical and/or electrolytic surface treatment, then substrate retention and handling are improved, but manufacturing tolerances and misalignment can still lead to leakage and uneven material deposition
Solution Approach 1:
The patent replaces traditional mechanical screw-based locking systems with a magnetic locking mechanism. The magnetic locking unit applies uniform magnetic force across the substrate holder, eliminating the need for multiple discrete mechanical fasteners that create stress concentration points. This substitution ensures even clamping force distribution, preventing substrate deformation and maintaining manufacturing precision during electrochemical processing.
Solution Approach 2:
The patent employs a reduced pressure holding unit that creates a vacuum environment within the substrate holder. By reducing the internal pressure parameter, the system enhances substrate retention through pressure differential without requiring excessive mechanical clamping force. This parameter change prevents leakage while maintaining substrate flatness and uniformity, directly addressing the contradiction between reliable retention and deposition precision.
2Ease of operation
If traditional substrate holding systems are used, then simple structure is maintained, but handling efficiency and automation capability are limited
Solution Approach 1:
The patent replaces manual screw-based locking mechanisms with an automated magnetic locking system controlled by a control unit. The magnetic locking unit responds to electrical signals, enabling automated substrate securing and release cycles. This substitution significantly improves ease of operation and automation capability, transforming a manually-intensive process into an automated sequence that enhances handling efficiency.
Solution Approach 2:
The substrate holder is designed with multi-functionality, integrating both the reduced pressure holding unit and magnetic locking unit within a single device. This universal design allows the system to perform multiple functions - vacuum sealing, magnetic clamping, and automated control - without requiring separate dedicated devices. The consolidated structure improves operational efficiency while managing device complexity through functional integration.
3Extent of automation
If magnetic locking alone is used, then easy automation is achieved, but secure retention under pressure differential may be insufficient
Solution Approach 1:
The patent merges two distinct retention mechanisms - the reduced pressure holding unit and the magnetic locking unit - into a unified substrate holder system. The reduced pressure unit creates vacuum retention, while the magnetic locking unit provides supplemental magnetic clamping force. This combination of mechanisms synergistically enhances substrate retention reliability, ensuring secure holding under pressure differential while maintaining automated control capability through the control unit.
Solution Approach 2:
The magnetic locking unit serves as a preemptive reinforcement mechanism that activates before pressure differential conditions can cause substrate release. By establishing magnetic clamping force in advance, the system cushions against potential retention failures that might occur during electrochemical processing. This prior cushioning approach ensures reliable substrate retention throughout the entire processing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides secure and flexible substrate handling, preventing leakage and ensuring uniform material deposition, even with increased manufacturing tolerances, and allows for easy automation and handling of substrates during chemical and electrolytic surface treatment processes.
Implementation Method 1
The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure
Implementation Method 2
The magnetic locking unit is configured to lock the substrate holder and the contact loop with each other by means of a magnetic force
Data Source
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AI summary
The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a substrate holding and locking method for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The substrate holding and locking system for chemical and/or electrolytic surface treatment comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element. The pump is arranged at the first element and/or the second element, and an additional external reduced pressure system is arranged outside the first element and the second element.