Magnetron Arc Mapping for In-Situ PVD Plasma Diagnosis
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Solution Overview
Problem
The challenge of reliably producing submicron and smaller features in semiconductor devices is exacerbated by arcing issues in physical vapor deposition (PVD) processes, which cause substrate damage and non-uniform film deposition, and determining the arc location within the chamber is difficult, leading to time-consuming and expensive troubleshooting.
Innovation Solution
A method and apparatus for monitoring arcing in a process chamber by determining the angular position of a magnetron relative to a substrate reference location and generating an arcing profile using positional information from a motor, allowing real-time plasma monitoring and diagnostics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional arc location detection methods are used, then arc locations can be identified, but the process chamber must be opened which causes time-consuming and expensive troubleshooting
Solution Approach 1:
The system performs preliminary mapping of arc locations by moving the magnetron to predetermined angular positions and recording arc data before actual production runs. This pre-characterization allows quick reference during troubleshooting without requiring chamber opening, thus resolving the contradiction between accurate arc location detection and troubleshooting time
Solution Approach 2:
The system creates a digital copy/map of arc locations through electromagnetic measurements and data recording, replacing the need for physical chamber opening and inspection. The arc location map serves as a virtual replica that enables rapid diagnosis without disrupting the vacuum environment, addressing both measurement precision and time loss concerns
2Ease of repair
If the process chamber is opened for troubleshooting, then arc sources can be located and repaired, but vacuum is broken and processing time is lost
Solution Approach 1:
The system implements continuous feedback by monitoring electromagnetic signals and arc characteristics during magnetron movement, building a comprehensive arc location map that guides repair efforts. This feedback mechanism enables accurate arc source identification without chamber opening, maintaining both ease of repair and productivity
Solution Approach 2:
The system introduces an intermediary diagnostic layer using electromagnetic sensors and signal processing that mediates between the arc discharge phenomenon and the physical chamber components. This intermediary approach allows arc location identification through non-invasive measurements, eliminating the need to break vacuum for troubleshooting while maintaining repair effectiveness
3Difficulty of detecting and measuring
If arc locations are not accurately determined, then troubleshooting is difficult, but opening the chamber for inspection is time-consuming and expensive
Solution Approach 1:
The system segments the arc detection process into discrete angular positions of the magnetron, measuring and mapping arc characteristics at each position. This segmentation transforms a complex continuous detection problem into manageable discrete measurements, reducing both detection difficulty and procedural complexity while maintaining accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring and diagnostics of arcing without opening the chamber, reducing downtime and costs by identifying arc locations without breaking vacuum, thus improving processing uniformity and reducing chamber maintenance.
Implementation Method 1
A source material, such as a target, is bombarded by ions strongly accelerated by an electric field. The bombardment ejects material from the target, and the material then deposits on the substrate.
Implementation Method 2
During deposition and etching using a magnetron assembly, arcing from the target to the substrate or chamber components can occur.
Implementation Method 3
A movable magnetron is disposed proximate a back side of the target opposite the front face and rotatable about a central axis of the substrate support
Implementation Method 4
arcing from the target to the substrate or chamber components can occur. Arcing can result in substrate damage and film deposition non-uniformity.
Data Source
AI summary
Methods of monitoring arcing in a process chamber, processing chambers and monitoring apparatus are described. At least one of the angular or radial position of a magnetron is determined in the chamber relative to a reference location on a surface of the substrate using positional information from one or more motors. An arcing profile is generated comprising a plurality of arcing states measured based at least on the determined angular and/or radial position of the magnetron.