Conductive Tracks via Magnetron Deposition and Laser Ablation
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Solution Overview
Problem
Existing methods for forming conductive tracks in electronics, such as thick-film and thin-film technologies, face limitations in resolution, controllability, and cost, with thick-film technology offering low resolution and high costs due to silver impurities and high-temperature requirements, while thin-film technology is complex and expensive with multi-stage processes and equipment needs.
Innovation Solution
A method involving magnetron deposition of a continuous multilayer coating with a chromium adhesion layer, copper conductive layer, and vanadium mask, followed by laser exposure and selective chemical etching to create high-quality conductive patterns with improved resolution and reduced process complexity, eliminating the need for photolithography and expensive equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thick-film technology is used to produce conductive tracks, then production cost is reduced and productivity is increased, but resolution is limited to 0.1-0.2 mm which is insufficient for microelectronic production
Solution Approach 1:
The patent replaces the mechanical template-based thick-film process with a magnetic field-based deposition system. A magnetron source generates magnetic fields that control metal atom deposition, enabling precise pattern formation without mechanical templates. This magnetic field control achieves resolution of 0.05-0.02 mm while maintaining high production speed and low cost characteristics.
2Temperature
If palladium silver-containing pastes are used for creating patterns, then co-firing temperature is reduced, but silver diffuses and impairs device parameters
Solution Approach 1:
The patent changes the material composition parameter from palladium silver paste to copper-containing paste. Although copper requires higher co-firing temperatures, the patent uses magnetic field deposition to control the copper layer formation, allowing the use of copper-based materials that provide better device reliability without silver diffusion issues, while the magnetic field process enables precise thickness control to manage the temperature requirement.
3Manufacturing precision
If thin-film technology is used to produce high-resolution metallization patterns, then resolution is improved, but the process becomes multi-stage and requires complex high-precision equipment
Solution Approach 1:
The patent merges multiple thin-film process stages into a single magnetic field deposition operation. Instead of separate photolithography, galvanic growth, and etching steps, the magnetron process deposits the complete metal pattern in one operation using magnetic field control, achieving high resolution (0.05-0.02 mm) while dramatically reducing process complexity and equipment requirements.
4Quantity of substance
If galvanic growth is used to increase copper layer thickness, then required thickness is achieved, but surface roughness increases
Solution Approach 1:
The patent replaces galvanic growth with magnetic field-based physical deposition. The magnetron process deposits metal atoms directly onto the substrate under magnetic field control, achieving the required thickness (15-40 microns) while maintaining smooth surface finish because the deposition is controlled by magnetic field distribution rather than electrochemical reactions that cause roughness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves high-quality conductive tracks with improved electric parameters, flexibility, and increased productivity by simplifying the process, reducing equipment costs, and allowing for precise thickness control, while avoiding the drawbacks of existing technologies.
Implementation Method 1
applying a continuous conductive multilayered coating onto a non-conductive substrate by a deposition method (for example, by a magnetron deposition method)
Implementation Method 2
the obtained metallization layer is exposed to action of a laser (preferably operated in the short-impulse mode), so a mask portion is evaporated, and, during this process the conductive layer may be partially evaporated also
Implementation Method 3
the substrate, after being irradiated by a laser, is etched in a chemical solution, selective etching agents not dissolving the mask material, but etching the conductive layer and the adhesion sub-layer in regions cleared from the mask
Data Source
AI summary
The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.