Mask-Integrated Surface Protective Tape for Plasma Dicing
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Solution Overview
Problem
The plasma dicing method requires a preliminary mask formation through photolithography, increasing chip production costs and leading to defective chips due to incomplete mask removal and longer processing times, as well as potential surface contamination and reduced transverse strength of semiconductor chips.
Innovation Solution
A mask-integrated surface protective tape with a substrate film, temporary-adhesive layer, and mask material layer containing (meth)acrylic copolymers, which is laminated on the semiconductor wafer, allowing for precise dicing without photolithography and easy removal of the mask material using O2 plasma, thereby reducing defective chips and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used for mask formation in plasma dicing, then dicing precision is improved, but processing time increases and production cost increases
Solution Approach 1:
The mask pattern is pre-formed on the tape before mounting to the wafer. This preliminary action eliminates the need for photolithography and other complex mask formation processes that would otherwise be required after wafer processing, thereby reducing processing time while maintaining dicing precision.
Solution Approach 2:
A specialized tape with pre-formed mask patterns serves as an intermediary carrier. The tape is mounted to the wafer surface, providing both mechanical support and the dicing mask function simultaneously, eliminating the need for separate photolithography and mask formation steps.
2Manufacturing precision
If photolithography is used for mask formation, then dicing precision is improved, but production cost increases
Solution Approach 1:
The mask formation function is merged with the tape substrate itself. The mask pattern is integrated into the tape structure during manufacturing, combining multiple functions (mechanical support, alignment reference, and dicing mask) into a single component, thereby eliminating the need for separate photolithography equipment and processes.
Solution Approach 2:
The tape with pre-formed mask patterns is a disposable consumable item. After use, the tape is removed and discarded along with any residual mask material, eliminating the need for expensive mask reuse, cleaning, and maintenance infrastructure associated with traditional photolithography systems.
3Device complexity
If blade dicing is used for wafer cutting, then processing simplicity is maintained, but chip transverse strength decreases and chipping occurs
Solution Approach 1:
The mechanical blade cutting process is replaced with plasma processing. The plasma selectively removes material along the scribe lines defined by the mask pattern on the tape, avoiding the mechanical contact and high cutting resistance that cause chipping and strength reduction, while maintaining processing simplicity through the same tape-guided approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution eliminates the need for photolithography, ensures high precision and certainty in dicing, and effectively prevents defective chips by providing good adhesion and peeling properties, thus enhancing chip quality and production efficiency.
Implementation Method 1
a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer
Implementation Method 2
easy removal of the mask material using O2 plasma
Implementation Method 3
an ashing step of removing the mask material layer by an O2 plasma
Data Source
AI summary
A mask-integrated surface protective tape, containing:a substrate film;a temporary-adhesive layer provided on the substrate film; anda mask material layer provided on the temporary-adhesive layer;wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; andwherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.