Mask Layout Adjustment for IC Wiring Defect Prevention

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Solution Overview

Problem

The miniaturization of integrated circuit devices has made it challenging to process wiring without defects such as open defects and short defects, as the curvature and spacing requirements are difficult to maintain during the manufacturing process.

Innovation Solution

A method for producing a mask layout that includes estimating the shape of the wiring based on the edge of a pattern in the exposure mask and modifying the shape if it does not meet the required curvature and spacing specifications, using techniques like one-stage or two-stage sidewall techniques and reactive ion etching, to ensure the wiring meets the necessary criteria.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wiring is miniaturized to increase integration density, then productivity and device functionality are improved, but manufacturing precision deteriorates due to difficulty in maintaining curvature and spacing requirements

Engineering Contradiction:

Improveintegration densityVSAvoidcurvature and spacing control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by modifying the mask layout before the actual wiring formation process. The curvature radius adjusting unit pre-adjusts curved portions and the spacing width adjusting unit pre-adjusts spacing widths in the mask layout to compensate for expected processing variations, ensuring that the final wiring meets design requirements even after miniaturization

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes geometric parameters of the mask layout pattern. The curvature radius adjusting unit modifies the curvature radius of curved wiring portions, and the spacing width adjusting unit modifies the spacing width between adjacent wirings. These parameter adjustments are made to account for processing effects and ensure manufacturing precision at miniaturized dimensions

Inventive Principle:

Principle #35Parameter changes

2Productivity

If wiring curvature radius is reduced to increase integration density, then productivity is improved, but reliability deteriorates due to stress concentration and defects

Engineering Contradiction:

Improveintegration densityVSAvoidwiring defect resistance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes the curvature radius parameter of wiring portions in the mask layout. The curvature radius adjusting unit specifically modifies curved portions to have optimized curvature radii that balance integration density with stress distribution, preventing stress concentration that would lead to open defects and short defects

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent incorporates feedback by using deposition amount information to adjust the mask layout. The system estimates deposition amounts at various positions, uses this feedback to determine appropriate curvature radii and spacing widths, and iteratively refines the mask layout to achieve both high integration density and high reliability

Inventive Principle:

Principle #23Feedback

3Productivity

If wiring spacing is reduced to increase integration density, then productivity is improved, but manufacturing precision deteriorates making it difficult to process without defects

Engineering Contradiction:

Improveintegration densityVSAvoidwiring processing accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-adjusting the spacing widths between adjacent wirings in the mask layout. The spacing width adjusting unit modifies spacing widths before wiring formation to compensate for expected processing variations, ensuring that even reduced spacing maintains adequate manufacturing precision and prevents defects

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the spacing width parameter between adjacent wirings. The spacing width adjusting unit optimizes these parameters to achieve the minimum required spacing for defect-free processing while maximizing integration density

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively suppresses stress concentration and defects in the wiring, ensuring that the curvature radius and spacing requirements are met, thereby preventing open and short defects and facilitating easier lithography without thickening the wiring or increasing the distance between them.

Implementation Method 1

a sidewall material is deposited on the side surface of the core material

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

an initial layout of an exposure mask is specified... estimating shape of wiring formed based on an edge of a pattern included in the initial layout

Methodology Applied

Scientific EffectPhotolithography: Photography

Data Source

PatentUS9257367B2Integrated circuit device, method for producing mask layout, and program for producing mask layout

Publication Date: 2016.02.09 KIOXIA CORP

AI summary

According to one embodiment, a method for producing a mask layout of an exposure mask for forming wiring of an integrated circuit device, includes estimating shape of the wiring formed based on an edge of a pattern included in an initial layout of the exposure mask. The method includes modifying shape of the edge if the estimated shape of the wiring does not satisfy a requirement.