Mass Transfer Tool Manipulator Assembly Active Alignment
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Solution Overview
Problem
The commercialization of miniaturized devices such as RF MEMS microswitches, LED display systems, and quartz-based oscillators is hindered by the difficulties and costs associated with manufacturing processes, particularly in transferring micro devices from a transfer wafer to a receiving wafer, which often require multiple bonding and de-bonding steps and techniques like laser lift-off, grinding, or polishing.
Innovation Solution
A mass transfer tool manipulator assembly is developed, comprising a housing, tip-tilt-z flexure, actuator assembly, and micro pick up array mount with integrated displacement sensors, enabling precise alignment and electrostatic transfer of micro devices using a feedback mechanism to adjust the spatial orientation and apply grip pressure, facilitating efficient pick-up and placement without damaging the devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional transfer printing methods are used involving multiple bonding and de-bonding steps, then micro devices can be transferred from transfer wafer to receiving wafer, but the process complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent extracts and eliminates the complex multiple bonding and de-bonding steps from the transfer process. By using a simplified direct transfer mechanism where the transfer wafer is removed after a single bonding step, the process complexity is dramatically reduced while maintaining the core transfer functionality.
Solution Approach 2:
Instead of using complex laser lift-off or grinding techniques to remove the transfer wafer, the patent inverts the approach by designing a system where the transfer wafer can be simply removed after bonding, and the devices remain attached to the receiving wafer through the bonding process itself.
2Manufacturing precision
If traditional transfer methods with multiple steps are used, then micro devices can be transferred, but the manufacturing cost increases due to techniques like laser lift-off, grinding, or polishing
Solution Approach 1:
The patent incorporates active alignment mechanisms with feedback control to achieve precise positioning of micro devices during transfer. Sensors detect misalignment and provide feedback to actuators that adjust the position, ensuring high precision without requiring expensive post-processing steps like laser lift-off or polishing.
Solution Approach 2:
The alignment and transfer process is designed to be self-correcting, where the system automatically adjusts for misalignment through integrated sensors and actuators, eliminating the need for expensive external processing steps.
3Measurement precision
If active alignment mechanisms are implemented, then transfer rate and precision are improved, but device complexity increases
Solution Approach 1:
The manipulator assembly is segmented into modular functional units: displacement sensors for detection, flexure mechanisms for motion, and actuators for adjustment. This segmentation allows each component to perform a specific function efficiently, reducing overall system complexity while maintaining high precision alignment capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the transfer rate of micro devices by enabling active alignment and smooth motion during pick-up and release, reducing the complexity and cost of manufacturing processes, and allowing for high-density integration of micro devices into various systems.
Implementation Method 1
contacting an array of micro devices on the carrier substrate with an array of electrostatic transfer heads
Implementation Method 2
sensing deformation of a compliant element coupled with the pivot platform
Data Source
AI summary
Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.