Master Substrate Laser Writing for Semiconductor Mask Alignment
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Solution Overview
Problem
In semiconductor device manufacturing, achieving high relative positional accuracy between multiple patterned layers and aligning stamps or masks in successive process steps is challenging due to the limitations in existing technologies for creating precise alignment marks and maintaining accurate overlay.
Innovation Solution
The method involves writing structures in different areas of a substrate using a laser beam recorder, with spirally or concentrically moving the laser spot and applying alignment marks at precise relative positions, allowing for high accuracy alignment of stamps or masks by creating a coherent set of patterns in a single run, using known mastering equipment and radiation-sensitive materials like photoresist or phase transition layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple stamps or masks are manufactured separately using conventional methods, then each stamp or mask can be produced independently, but the relative positional accuracy between patterns on different stamps or masks deteriorates
Solution Approach 1:
The patent combines the manufacturing of multiple stamps or masks into a single master substrate using one laser beam recorder. Different areas on the same substrate are exposed to write multiple patterns simultaneously in one setup, ensuring that all patterns share a common reference frame and achieve very high relative positional accuracy without requiring complex separate manufacturing processes
2Manufacturing precision
If alignment marks are incorporated in masks or stamps, then accurate overlay in successive process steps is achieved, but the complexity of manufacturing and aligning multiple masks or stamps increases
Solution Approach 1:
The patent incorporates alignment marks directly during the initial exposure step when writing patterns on the master substrate. By pre-positioning alignment marks in known locations relative to each pattern area, the system eliminates the need for separate alignment mark addition steps and simplifies the overall manufacturing process while ensuring high alignment accuracy
3Manufacturing precision
If a single substrate is used to produce multiple patterns, then the relative positional accuracy between patterns is improved, but the area of the substrate required increases
Solution Approach 1:
The patent utilizes the two-dimensional surface of a single substrate efficiently by arranging multiple pattern areas in different regions of the same substrate plane. This approach maintains high relative positional accuracy through a unified reference frame while avoiding the need for multiple separate substrates, as the substrate area is optimally utilized to accommodate all required patterns in one exposure run
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures very high relative positional accuracy between patterns on different areas of the substrate, enabling precise alignment of stamps or masks in subsequent process steps, thereby improving the accuracy of semiconductor device manufacturing.
Implementation Method 1
applying a layer of a radiation sensitive material to a surface of the substrate, illuminating the sensitive material on the substrate in a desired pattern by moving a focused laser spot over the substrate
Implementation Method 2
The sensitive material may be a photo-sensitive material or a phase transition layer
Data Source
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AI summary
The invention provides a method of manufacturing a substrate comprising at least two areas with the same or different pattern(s) on the surface of the substrate. The process comprises the steps of providing the substrate applying a layer of a radiation sensitive material on the substrate, recording the pattern(s) on the at least two areas (2a to 2d) in the layer of radiation sensitive material by circularly moving a focused recording spot in one sweep over the entire substrate (1) in the layer of sensitive material by moving a focused laser spot in one sweep over the entire substrate, and developing the layer of sensitive material. The invention further provides a method for manufacturing at least two stamps or masks for manufacturing of semiconductor devices using a mastering process.