Matching Circuit Board Recess Layout for Thermal Crack Control
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Solution Overview
Problem
Radio frequency amplification devices face challenges due to the thin thickness of matching circuit boards, which can lead to cracks and impaired circuit functions under varying temperature conditions, especially when the coefficient of linear expansion of the package material differs from that of the matching circuit board material.
Innovation Solution
The amplification device incorporates a matching circuit board with recesses on both sides, which control the location of cracks, ensuring that the line connecting the recesses is positioned to minimize the loss of circuit function, even under temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the matching circuit board is made thin to reduce size, then the device compactness is improved, but the board becomes prone to cracks under temperature changes
Solution Approach 1:
The matching circuit board is segmented by providing recesses that divide the board into multiple regions. These recesses act as stress relief zones that prevent crack propagation across the entire board, allowing the board to remain thin while maintaining reliability under temperature variations.
Solution Approach 2:
The recesses are strategically positioned at specific locations on the matching circuit board where stress concentration is most likely to occur. This local modification creates stress relief zones precisely where needed, preventing cracks without requiring the entire board to be thicker.
2Stability of the object's composition
If the matching circuit board material is changed to match the package coefficient of linear expansion, then thermal stress is reduced, but material selection becomes more restricted
Solution Approach 1:
The stress management function is extracted from the material selection requirement. Instead of requiring the matching circuit board material to perfectly match the package's coefficient of linear expansion, the recesses are introduced to independently handle thermal stress, freeing material selection while still preventing cracks.
3Reliability
If recesses are added to control crack locations, then circuit function loss is minimized, but manufacturing complexity increases
Solution Approach 1:
The recesses are pre-formed during the board manufacturing process before the board is assembled into the device. This preliminary action of creating stress relief zones during manufacturing simplifies the overall process, as no additional steps are needed later to address potential cracking issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the degree of loss of circuit function in the matching circuit board, maintaining its functionality despite temperature-induced stresses and potential cracks.
Implementation Method 1
A first recess is provided in the first side surface. A second recess facing the first recess is provided in the second side surface... control the location of cracks
Implementation Method 2
the coefficient of linear expansion of the package material differs from that of the matching circuit board material... under varying temperature conditions... temperature-induced stresses
Data Source
AI summary
An amplification device includes a base substrate, an amplification element, and a matching circuit board. The amplification element is mounted on the base substrate. The matching circuit board is mounted on the base substrate and includes a circuit pattern which is electrically connected to the amplification element. The matching circuit board includes a first side surface and a second side surface each extending in the longitudinal direction of the matching circuit board. A first recess is provided in the first side surface. A second recess facing the first recess is provided in the second side surface.