Multi-Chip Package System With Substrate Cavity Sensors

The patent transitions from two-dimensional planar integration to three-dimensional vertical integration by stacking multiple semiconductor dies in the Z-direction. The redistribution layers are formed in multiple tiers at different heights, enabling electrical connections between dies through vertical vias and conductive structures, thereby increasing integration density without proportionally increasing package footprint area.

The patent implements a nested structure where multiple semiconductor dies are stacked vertically within a single package footprint. Each die is positioned at a different height level, with redistribution layers and conductive structures nested between and around the dies. This nesting approach allows multiple functional units to occupy the same horizontal space by utilizing the vertical dimension.

The patent merges multiple functional layers into a compact three-dimensional architecture where semiconductor dies, redistribution layers, and conductive structures are combined in a stacked configuration. The redistribution layers are integrated between the dies rather than being separate external connections, and the entire assembly is enclosed within a single package housing, reducing overall height compared to alternative packaging approaches.

The patent utilizes vertical stacking in the Z-direction to achieve high integration density while controlling package height. By forming redistribution layers at multiple height levels and connecting dies through vertical conductive paths, the design efficiently uses the vertical dimension to accommodate multiple dies without requiring excessive height, as the structures are tightly integrated rather than loosely stacked.