Memory Module Board Adapter for Hot-Swap Test Configuration Retention
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Solution Overview
Problem
Current methods for testing memory modules, such as using Automatic Test Equipment (ATE) or CPU mainboards, are costly and do not accurately analyze issues in practical applications, as they test DRAM chips in isolation rather than in system platforms, leading to inaccurate results and loss of modifications during power-off or reset.
Innovation Solution
A board adapter device with a gold finger and connector structure that connects data, clock, address, and control signal lines, and converts power input signals to match the memory module's power supply, allowing hot-swapping and independent power control, enabling flexible and accurate testing on various system platforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ATE or CPU mainboard is used for testing memory modules, then testing capability is achieved, but testing cost increases significantly
Solution Approach 1:
The patent introduces a board adapter as an intermediary device between the memory module and the test platform. The board adapter includes a connector for the memory module, a configuration board, and a signal transmission structure that interfaces with both the memory module's gold finger and the test platform, enabling cost-effective testing without requiring expensive ATE or CPU mainboard modifications
Solution Approach 2:
The testing system is segmented into independent functional modules: the memory module under test, the board adapter (which itself contains the configuration board and signal transmission structure), and the test platform. This segmentation allows the testing functionality to be separated from expensive mainboard resources, reducing overall testing cost while maintaining reliability
2Productivity
If DRAM chip is tested in isolation using ATE or mainboard, then testing can be performed, but testing accuracy for practical applications deteriorates
Solution Approach 1:
The board adapter is designed with universal compatibility to work with different memory module types and test platforms. The configuration board can control DRAM chips to enter test modes, and the signal transmission structure maintains proper signal integrity, enabling accurate testing that reflects practical application conditions while maintaining high testing efficiency
Solution Approach 2:
The board adapter acts as an intermediary that preserves the operational context of the memory module during testing. By maintaining connections for data signals, clock signals, address signals, and control signals through the gold finger interface, it enables testing that accurately reflects practical application conditions rather than isolated chip testing
3Adaptability or versatility
If configuration changes are made during testing, then test parameters can be adjusted, but modifications are lost during power-off or reset
Solution Approach 1:
The configuration board is designed to maintain test mode settings and configuration changes in advance before power-off or reset occurs. The system preserves these configurations through the board adapter's persistent state, so when power is restored, the memory module automatically returns to the configured test mode without requiring reconfiguration
Solution Approach 2:
The board adapter implements feedback mechanisms that monitor and maintain test mode configurations. The configuration board continuously manages the test state, and upon power restoration, the system detects the need to maintain previous configurations and automatically restores them, preventing information loss
Data Source
AI summary
A board adapter device includes: a first adapter structure provided with a gold finger matched with a board of a target memory module, a second adapter structure provided with a connector matched with the gold finger, and a signal transmission structure including a first and second transmission module. The first transmission module is for connecting a data signal line, a clock signal line, an address signal line, and a control signal line of the gold finger to corresponding connecting lines of the connector. The second transmission module is configured to, when receiving a power input signal, convert the power input signal into a power output signal matched with a power supply of the target memory module, and transmit the power output signal to a power signal line of the connector.