Memory Package Buffer Die for Dynamic ECC Allocation
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Solution Overview
Problem
Existing semiconductor memory devices face inefficiencies and compatibility issues due to the use of external module logic and buffers, which can lead to reliability and error correction limitations.
Innovation Solution
Incorporating a buffer die within the memory package to facilitate direct communication between the memory devices and a controller, eliminating the need for external buffers and logic, and dynamically allocating error correction code (ECC) data based on error rates to optimize memory array space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If external module logic and buffers are used, then device complexity is reduced, but reliability and error correction capabilities deteriorate
Solution Approach 1:
The patent extracts the buffer logic from external modules and relocates it within the memory device itself. This allows the memory device to maintain reduced external complexity while achieving improved reliability through integrated error correction capabilities and dedicated buffer structures that operate independently of external controller logic.
Solution Approach 2:
The patent introduces an intermediary buffer structure within the memory device that mediates between the memory array and external controllers. This internal buffer acts as a mediator that can perform error correction and data buffering operations locally, improving reliability without requiring complex external logic.
2Manufacturing precision
If fixed ECC data allocation is used, then manufacturing precision is improved, but adaptability deteriorates
Solution Approach 1:
The patent implements dynamic ECC allocation where the amount of ECC data stored in the buffer can be adjusted based on actual error rates and operational conditions. This dynamic approach allows the system to adapt to varying reliability requirements while maintaining precise control over memory array space allocation through programmable parameters.
Solution Approach 2:
The patent enables parameter changes in ECC allocation by allowing the buffer size and ECC data amount to be configured based on error rate measurements and operational needs. This flexibility is achieved through programmable parameters that can be set during initialization or adjusted during operation, maintaining manufacturing precision while improving adaptability.
3Reliability
If more ECC data is stored, then reliability is improved, but memory array space is reduced
Solution Approach 1:
The patent segments the ECC storage function between the memory array and a dedicated buffer. By dividing the storage responsibility, the system can store necessary ECC data in the buffer without permanently reducing the memory array space available for user data, thus maintaining both reliability and storage capacity.
Solution Approach 2:
The buffer acts as an intermediary storage structure that temporarily holds ECC data needed for error correction. This intermediary approach allows the system to maintain high reliability through adequate ECC protection while preserving memory array space, as the buffer operates as a separate entity that does not permanently consume array capacity.
Data Source
AI summary
A memory package may include multiple memory devices and a buffer die. In some examples, the buffer die and/or one or more of the memory devices may include an error correction code (ECC) circuit and/or a device health analysis circuit (DHAC). In some examples, memory devices may store ECC data for one or more other memory devices in the memory package. In some examples, memory arrays of the memory devices may be reorganized (reconfigured) to store more or less ECC data to dynamically allocate space to ECC data. In some examples, how much ECC data is stored for a memory device may be based, at least in part, on the error rate of the memory device.