Memory Package Buffer Die Multiplexing for Lower-Latency Modules
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Solution Overview
Problem
Existing semiconductor memory devices face inefficiencies and compatibility issues due to the use of module logic and buffers manufactured by entities different from the memory devices and controller, leading to quality control and unforeseen compatibility problems.
Innovation Solution
Implementing a memory package with a buffer die that includes multiplexing components, allowing for data buffering and multiplexing within the package, reducing the need for additional components on the memory module and enhancing compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If module logic and buffers are manufactured by different entities than memory devices, then device specialization is improved, but compatibility and quality control deteriorate
Solution Approach 1:
The patent combines the buffer die with memory devices into a single memory package, manufactured by the same entity. This merging eliminates compatibility issues between separately manufactured components while maintaining the specialized functions of both buffers and memory devices within an integrated package
2Adaptability or versatility
If additional components are used on memory modules for buffering and multiplexing, then functionality is improved, but device complexity increases
Solution Approach 1:
The buffer die is integrated directly into the memory package, merging the buffering function with the memory device. This eliminates the need for separate buffer components on the memory module, reducing overall system complexity while maintaining full buffering functionality
Solution Approach 2:
The buffer die performs multiple functions including data buffering, multiplexing, and coordination within the memory package. This multi-functionality consolidates what would otherwise require multiple separate components, reducing device complexity
3Productivity
If data buffering and multiplexing are performed at the module level, then bandwidth is improved, but latency increases
Solution Approach 1:
The patent moves the buffering and multiplexing function from the module level to the package level, changing the spatial dimension of where these operations occur. This closer proximity to the memory devices reduces signal travel time and latency while maintaining the bandwidth benefits of buffered operations
Data Source
AI summary
A memory package may include multiple memory die and a buffer die in some examples. The memory package may be included on a memory module. The memory module may include multiple memory packages. The buffer die may include components that reduce or eliminate a number of components on the memory module. In some embodiments, the buffer die may have components for performing error correction code operations, providing redundant memory portions, contention handling, multiplexing, interleaving, consolidating temperature and/or access information, self-testing, and/or self-training. In some examples, the memory package may include multilevel signaling, row buffers, memory built in self-testing, and/or modifications for processor-in-memory operations or accelerators therefor.