Memory Cell Diode Configuration for Low Line Resistance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The 2D/1R memory cell array architecture experiences low set and reset currents due to high resistance in the bit and reset lines, limiting its performance.

Innovation Solution

The memory cell design includes a first diode with an N-type doped region connected to a bit line and a second diode with a P-type doped region connected to a reset line, both on a semiconductor substrate, with isolation structures to reduce line resistance and increase current flow, using a data storage material layer between electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the n-well of the first diode is used as a bit line and the p-well of the second diode is used as a reset line in the 2D/1R array architecture, then the array density and working current are improved, but the set current and reset current become small

Engineering Contradiction:
Improvearray densityVSAvoidset current and reset current
Core Design Contradiction:
Quantity of substanceVSPower

Solution Approach 1:

The patent divides the bit line and reset line into separate dedicated lines instead of using the well regions directly as lines. This segmentation allows independent optimization of each line's resistance and current-carrying capacity, resolving the contradiction between high density and sufficient current.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediate connection structures (metal contacts and interconnect lines) between the diodes and the bit/reset lines. These intermediaries provide low-resistance pathways that enable high current flow while maintaining the compact 2D/1R architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the n-well and p-well are used directly as bit and reset lines, then the device complexity is reduced, but the line resistance increases

Engineering Contradiction:
Improvedevice complexityVSAvoidline resistance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent changes the resistance parameter of the bit and reset lines by using heavily doped semiconductor regions and metal interconnects instead of lightly doped well regions. This parameter change reduces line resistance while maintaining the simplicity of the overall device structure.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the resistance of the bit and reset lines, thereby increasing the set and reset currents, enhancing the array's operational efficiency.

Implementation Method 1

PN junction is formed at the interface between the P+ doped region and the n-well. The second diode of the two diodes includes an N+ doped region and a p-well. PN junction is formed at the interface between the N+ doped region and a p-well.

Methodology Applied
Scientific EffectPN junction:

Implementation Method 2

Problems arise, however, the set current and the reset current of the 2D/1R array architecture described above are small. Therefore, there is a need to provide array architecture of a 2D/1R in which the reset current and the reset current may be increased.

Methodology Applied
Scientific EffectElectrical resistance: Electrical Resistance

Data Source

PatentUS10460803B2Memory cell, memory cell array, memory device and operation method of memory cell array
Publication Date: 2019.10.29 SEMICON MFG INT (SHANGHAI) CORP
  • US10460803B2 patent drawing
  • US10460803B2 patent drawing
  • US10460803B2 patent drawing

AI summary

Semiconductor devices and fabrication methods thereof are provided to form a memory cell. The memory cell includes a first diode, a second diode separated from the first diode. The first diode includes a first well region in a substrate, a first N-type doped region adjacent to the first well region and connected to a bit line, and a first P-type doped region adjacent to the first well region and separated from the first N-type doped region. The second diode includes a second well region in the substrate, a second N-type doped region adjacent to the second well region, and a second P-type doped region. The memory cell further includes a bottom electrode connected to the first P-type doped region and the second N-type doped region, respectively, a top electrode connected to a word line, and a data storage material layer located between the bottom electrode and the top electrode.