Memory Chip I/O Pad Circuit Driver Capability Scaling

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Solution Overview

Problem

The existing multi-chip packaging techniques for semiconductor memory devices face challenges in efficiently increasing the driver capability of I/O pad circuits as the number of memory chips increases, leading to reduced program performance due to decreased driver capability.

Innovation Solution

The implementation of redundant driver circuits in the I/O pad circuit, which are selectively configured during the wiring process to generate additional driver signals, enabling increased driver capability by determining logic levels and coupling transistors and resistors to manage power supply voltages and ground nodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of memory chips is increased to improve storage capacity, then the storage capacity is improved, but the driver capability of the I/O pad circuit is reduced

Engineering Contradiction:
Improvestorage capacityVSAvoiddriver capability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The I/O pad circuit is segmented into multiple independent driver circuits (first driver circuit, second driver circuit, third driver circuit) that can be selectively activated. Each driver circuit can independently drive the I/O pad, allowing the system to scale driver capability according to the number of memory chips without requiring a single overly complex driver.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The driver capability is made dynamic through selective activation of different driver circuits based on operational requirements. The controller can dynamically enable or disable specific driver circuits depending on whether single-chip or multi-chip operations are being performed, optimizing performance for each scenario.

Inventive Principle:
Principle #15Dynamics

2Reliability

If redundant driver circuits are added to increase driver capability, then the driver capability is improved, but the device complexity is increased

Engineering Contradiction:
Improvedriver capabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple driver circuits share the same I/O pad and control logic structure, making them universally interchangeable. Each driver circuit is designed with identical functionality, allowing any of them to take over depending on the operational mode. This universality reduces the actual complexity increase despite having multiple circuits.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The driver circuits are designed as replicated copies of each other with identical internal structures and control mechanisms. This copying approach allows for systematic expansion of driver capability while maintaining manageable complexity through standardized, repeatable design units rather than creating entirely new complex circuits.

Inventive Principle:
Principle #26Copying

3Speed

If multiple data I/O buffer circuits are enabled simultaneously, then the data I/O speed is improved, but the power consumption is increased

Engineering Contradiction:
Improvedata I/O speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The system dynamically adjusts the number of active data I/O buffer circuits based on real-time operational requirements. During high-speed data transfer operations involving multiple memory chips, more buffer circuits are enabled. During normal single-chip operations, fewer buffers are active, reducing power consumption while maintaining adequate performance.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The operational state of each data I/O buffer circuit is changed as a controllable parameter. The controller can adjust the enable/disable state of individual buffer circuits based on the number of active memory chips and data transfer requirements, optimizing the balance between speed and power consumption for each operational scenario.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8279651B2Memory chip package with efficient data I/O control
Publication Date: 2012.10.02 SK HYNIX INC
  • US8279651B2 patent drawing
  • US8279651B2 patent drawing
  • US8279651B2 patent drawing

AI summary

A memory chip includes a memory circuit unit configured to include memory cells for storing data, a data input and output (I/O) buffer unit configured to include a plurality of data I/O buffer circuits, wherein one of the data I/O buffer circuits is operated by default in order to input and output data to and from the memory chip, a plurality of driver control units configured to generate a plurality of driver addition signals to enable corresponding ones of the data I/O buffer circuits depending on whether a power supply voltage has been received, and a controller configured to generate I/O enable signals for controlling an operation of the data I/O buffer unit.