Memory Device Conductive Plate Repair With Redundant Sections
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Solution Overview
Problem
Memory devices with conductive plates can suffer from shorts during fabrication, leading to discarded products and increased costs due to reduced yield.
Innovation Solution
Incorporating a redundant memory portion to replace damaged areas caused by shorts, allowing the memory device to reroute operations to functional conductive plates, thereby maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a short occurs in conductive plates during fabrication, then the memory device must be discarded, but this reduces yield and increases cost
Solution Approach 1:
The patent applies preliminary action by pre-configuring redundant conductive plates and associated memory circuitry during fabrication, before any shorts occur. These redundant components are prepared in advance and can be activated through repair logic to replace damaged conductive plates, thereby maintaining production yield without requiring complete device discarding
2Productivity
If redundant memory portion is incorporated to replace damaged areas, then yield improves, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the memory device into functional segments associated with individual conductive plates. Each conductive plate has its own redundant replacement components and repair logic, allowing independent repair of damaged segments without affecting the entire device. This modular segmentation manages complexity by localizing redundancy rather than implementing global redundancy
Data Source
AI summary
Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes conductive plates adjacent each other; memory cells associated with the conductive plates; drivers coupled to the conductive plates such that one of the drivers is associated with one of the conductive plates; and a short coupled between a first conductive plate of the conductive plate and a second conductive plate of the conductive plates.